Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding
Cu direct bonding technology is a critical approach for achieving highly integrated packaging structures. Recent studies demonstrate that utilizing nanostructured Cu enables a significant reduction in Cu–Cu bonding temperature, where nanoscale grain growth plays a crucial role. However, the thermody...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425015807 |
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