Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effec...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Wiley
2013-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2013/123697 |
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| _version_ | 1850179120463347712 |
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| author | Liu Mei Lee Ahmad Azmin Mohamad |
| author_facet | Liu Mei Lee Ahmad Azmin Mohamad |
| author_sort | Liu Mei Lee |
| collection | DOAJ |
| description | This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community. |
| format | Article |
| id | doaj-art-be809ccfec294310b3e531b5400ed5af |
| institution | OA Journals |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2013-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-be809ccfec294310b3e531b5400ed5af2025-08-20T02:18:35ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422013-01-01201310.1155/2013/123697123697Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A ReviewLiu Mei Lee0Ahmad Azmin Mohamad1School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, MalaysiaSchool of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, MalaysiaThis paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.http://dx.doi.org/10.1155/2013/123697 |
| spellingShingle | Liu Mei Lee Ahmad Azmin Mohamad Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review Advances in Materials Science and Engineering |
| title | Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review |
| title_full | Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review |
| title_fullStr | Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review |
| title_full_unstemmed | Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review |
| title_short | Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review |
| title_sort | interfacial reaction of sn ag cu lead free solder alloy on cu a review |
| url | http://dx.doi.org/10.1155/2013/123697 |
| work_keys_str_mv | AT liumeilee interfacialreactionofsnagculeadfreesolderalloyoncuareview AT ahmadazminmohamad interfacialreactionofsnagculeadfreesolderalloyoncuareview |