Electrospun Biocarriers with Immobilized Yeasts for Eco-Friendly Biocontrol of <i>Fusarium graminearum</i>

This study reports, for the first time, the successful application of chitosan oligosaccharide (COS) and 2-hydroxyethyl cellulose (HEC) coatings on electrospun poly(3-hydroxybutyrate) (PHB) materials for the immobilization of non-conventional yeast strains with fungal biocontrol potential. The coati...

Full description

Saved in:
Bibliographic Details
Main Authors: Petya Tsekova, Mariana Petkova, Mariya Spasova, Olya Stoilova
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Agronomy
Subjects:
Online Access:https://www.mdpi.com/2073-4395/15/7/1541
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This study reports, for the first time, the successful application of chitosan oligosaccharide (COS) and 2-hydroxyethyl cellulose (HEC) coatings on electrospun poly(3-hydroxybutyrate) (PHB) materials for the immobilization of non-conventional yeast strains with fungal biocontrol potential. The coatings enhanced the surface wettability of PHB fibers, facilitating efficient yeast adhesion and viability maintenance. Among the tested strains, <i>Pichia acaciae</i> YD6 was newly isolated and characterized, while <i>Pichia fermentans</i> YP6 and <i>Zygosaccharomyces bailii</i> YE1 had previously been identified as endophytic colonizers. All three strains demonstrated high adaptability, efficient immobilization, and antagonistic activity, confirming their potential for biocontrol applications. COS-coated PHB fibers promoted greater colony expansion than those coated with HEC. Antifungal assays of the yeast-containing biocarriers showed significant inhibition of <i>F. graminearum</i> growth. These findings underscore the potential of PHB-based fibrous materials as sustainable, bioactive carriers for yeast immobilization, with desirable biological properties. This approach offers a promising and eco-friendly strategy for pest control and bioactive agent delivery in agricultural applications.
ISSN:2073-4395