First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder
This study systematically investigated the influence of Co particles addition on the properties of Sn-1.0Ag-0.5Cu (SAC105) solder through a combined approach of first-principles calculations and experimental characterization. First-principles calculations revealed that the adding Co particles signif...
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Elsevier
2025-06-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025014264 |
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| author | Xing-yu Guo Liang Zhang Yu-hao Chen Hyoung Seop Kim Nan Jiang Chuan-jiang Wu Xi Huang Yun-xin Liu |
| author_facet | Xing-yu Guo Liang Zhang Yu-hao Chen Hyoung Seop Kim Nan Jiang Chuan-jiang Wu Xi Huang Yun-xin Liu |
| author_sort | Xing-yu Guo |
| collection | DOAJ |
| description | This study systematically investigated the influence of Co particles addition on the properties of Sn-1.0Ag-0.5Cu (SAC105) solder through a combined approach of first-principles calculations and experimental characterization. First-principles calculations revealed that the adding Co particles significantly increased in the elastic modulus of SAC105 solder. In addition, the (Cu, Co)6Sn5 intermetallic compound (IMC) exhibited superior thermodynamic stability compared to conventional Cu6Sn5. Microstructural analysis showed that the adding Co particles resulted in both interfacial morphology smoothing and grain refinement. Significantly, this modification process was found to promote the growth of the interfacial layer. The analysis revealed the conversion of Cu6Sn5 to (Cu, Co)6Sn5 within the IMC layer, accompanied by the formation of blocky (Cu, Co)6Sn5 near the IMC layer. Experimental results demonstrated that incorporation of Co particles into SAC105 solder induced no significant alteration in the thermal properties of the solder alloys. Nevertheless, the wettability and mechanical properties of composite solder showed improvement. The best shear strength was obtained at Co content of 0.06 wt %. At the Co content of 0.1 wt %, the composite solder achieved superior wettability, exhibiting a reduced contact angle of 24.03° |
| format | Article |
| id | doaj-art-b96c652dc81b41588fb1cce63df8fc51 |
| institution | OA Journals |
| issn | 2590-1230 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-b96c652dc81b41588fb1cce63df8fc512025-08-20T02:26:56ZengElsevierResults in Engineering2590-12302025-06-012610535610.1016/j.rineng.2025.105356First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solderXing-yu Guo0Liang Zhang1Yu-hao Chen2Hyoung Seop Kim3Nan Jiang4Chuan-jiang Wu5Xi Huang6Yun-xin Liu7School of materials science and engineering, Xiamen University of Technology, Xiamen 361000, ChinaSchool of materials science and engineering, Xiamen University of Technology, Xiamen 361000, China; Corresponding authors.School of materials science and engineering, Xiamen University of Technology, Xiamen 361000, ChinaAdvanced Institute for Materials Research (WPI-AIMR), Tohoku University, Sendai, 980-8577, Japan; Corresponding authors.Graduate Institute of Ferrous & Eco Materials Technology, POSTECH (Pohang University of Science and Technology), Pohang 790-794, Republic of Korea; State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, ChinaSchool of materials science and engineering, Xiamen University of Technology, Xiamen 361000, ChinaSchool of materials science and engineering, Xiamen University of Technology, Xiamen 361000, ChinaSchool of materials science and engineering, Xiamen University of Technology, Xiamen 361000, ChinaThis study systematically investigated the influence of Co particles addition on the properties of Sn-1.0Ag-0.5Cu (SAC105) solder through a combined approach of first-principles calculations and experimental characterization. First-principles calculations revealed that the adding Co particles significantly increased in the elastic modulus of SAC105 solder. In addition, the (Cu, Co)6Sn5 intermetallic compound (IMC) exhibited superior thermodynamic stability compared to conventional Cu6Sn5. Microstructural analysis showed that the adding Co particles resulted in both interfacial morphology smoothing and grain refinement. Significantly, this modification process was found to promote the growth of the interfacial layer. The analysis revealed the conversion of Cu6Sn5 to (Cu, Co)6Sn5 within the IMC layer, accompanied by the formation of blocky (Cu, Co)6Sn5 near the IMC layer. Experimental results demonstrated that incorporation of Co particles into SAC105 solder induced no significant alteration in the thermal properties of the solder alloys. Nevertheless, the wettability and mechanical properties of composite solder showed improvement. The best shear strength was obtained at Co content of 0.06 wt %. At the Co content of 0.1 wt %, the composite solder achieved superior wettability, exhibiting a reduced contact angle of 24.03°http://www.sciencedirect.com/science/article/pii/S2590123025014264Sac105 solderIMCCo particlesShear strengthFirst-principles |
| spellingShingle | Xing-yu Guo Liang Zhang Yu-hao Chen Hyoung Seop Kim Nan Jiang Chuan-jiang Wu Xi Huang Yun-xin Liu First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder Results in Engineering Sac105 solder IMC Co particles Shear strength First-principles |
| title | First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder |
| title_full | First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder |
| title_fullStr | First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder |
| title_full_unstemmed | First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder |
| title_short | First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder |
| title_sort | first principles and experimental investigations on the mechanical properties of co particles modified sn 1 0ag 0 5cu solder |
| topic | Sac105 solder IMC Co particles Shear strength First-principles |
| url | http://www.sciencedirect.com/science/article/pii/S2590123025014264 |
| work_keys_str_mv | AT xingyuguo firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT liangzhang firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT yuhaochen firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT hyoungseopkim firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT nanjiang firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT chuanjiangwu firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT xihuang firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder AT yunxinliu firstprinciplesandexperimentalinvestigationsonthemechanicalpropertiesofcoparticlesmodifiedsn10ag05cusolder |