Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%

Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%

This paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesa structures in a NaOH 35% solution. Final etching shapes of micromachined structures show a marked anisotropy of type 1. Etching shapes are analysed in terms of the kinematic and tensorial model for the anisotropic...

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Bibliographic Details
Main Authors: C. R. Tellier, C. A. Hodebourg, S. Durand
Format: Article
Language:English
Published: Wiley 2001-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/2001/73462
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