Bessel Beam Femtosecond Laser Interaction with Fused Silica Before and After Chemical Etching: Comparison of Single Pulse, MHz-Burst, and GHz-Burst

We investigate the elongated modifications resulting from a Bessel beam-shaped femtosecond laser in fused silica under three different operation modes, i.e., the single-pulse, MHz-burst, and GHz-burst regimes. The single-pulse and MHz-burst regimes show rather similar behavior in glass, featuring el...

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Bibliographic Details
Main Authors: Théo Guilberteau, Pierre Balage, Manon Lafargue, John Lopez, Laura Gemini, Inka Manek-Hönninger
Format: Article
Language:English
Published: MDPI AG 2024-10-01
Series:Micromachines
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Online Access:https://www.mdpi.com/2072-666X/15/11/1313
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Summary:We investigate the elongated modifications resulting from a Bessel beam-shaped femtosecond laser in fused silica under three different operation modes, i.e., the single-pulse, MHz-burst, and GHz-burst regimes. The single-pulse and MHz-burst regimes show rather similar behavior in glass, featuring elongated and slightly tapered modifications. Subsequent etching with Potassium Hydroxide exhibits an etching rate and selectivity of up to 606 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m/h and 2103:1 in single-pulse operation and up to 322 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m/h and 2230:1 in the MHz-burst regime, respectively. Interestingly, in the GHz-burst mode, modification by a single burst of 50 pulses forms a taper-free hole without any etching. This constitutes a significant result paving the way for chemical-free, on-the-fly drilling of high aspect-ratio holes in glass.
ISSN:2072-666X