Reliability analysis based on cascaded-Foster thermal networks for systems-in-package (SiP)
This paper presents a fast and comprehensive method for reliability prediction of 3D System-in-Package (3D SiP) technologies. The proposed approach accounts for both critical wear-out failure mechanisms and mission-specific profiles. A novel reliability assessment framework is introduced to address...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025020377 |
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