Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures
With rapid industrial development, effective thermal management has become essential for modern insulating materials. However, conventional aramid paper-based materials face substantial challenges in meeting these evolving demands due to their low thermal conductivity. This study demonstrates a nove...
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| Format: | Article |
| Language: | English |
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KeAi Communications Co., Ltd.
2025-07-01
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| Series: | Advanced Industrial and Engineering Polymer Research |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S254250482500020X |
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| author | Qianshun Zhang Wenzhuo Wu Wenqi Zheng Qi Huang Zhanyu Zhou Junpeng Wang Xuerui Xiao Hua Wang Siwei Xiong Luoxin Wang Shiwen Yang |
| author_facet | Qianshun Zhang Wenzhuo Wu Wenqi Zheng Qi Huang Zhanyu Zhou Junpeng Wang Xuerui Xiao Hua Wang Siwei Xiong Luoxin Wang Shiwen Yang |
| author_sort | Qianshun Zhang |
| collection | DOAJ |
| description | With rapid industrial development, effective thermal management has become essential for modern insulating materials. However, conventional aramid paper-based materials face substantial challenges in meeting these evolving demands due to their low thermal conductivity. This study demonstrates a novel fabrication method combining natural sedimentation filtration and thermal lamination to integrate hexagonal boron nitride (h-BN) into aramid/polyphenylene sulfide (PPS) composite paper, resulting in high thermal conductivity insulating aramid composite paper with a gradient structure and sandwich structure. At 60 wt% h-BN loading, the composite exhibits remarkable through-plane thermal conductivity (0.461 W/mK) and breakdown strength (40.96 kV/mm). These values show 255 % and 31.8 % improvements, respectively, over the h-BN-free control sample prepared under identical conditions. The thermal conductivity network formed by h-BN significantly enhances the TC of the composite. The exterior PPS film layer of the sandwich structure substantially augments the composite paper's resilience against thermal stress, chemical corrosion, and electromagnetic radiation. This enhanced durability renders the material highly promising for applications in various domains, including but not limited to electronics and electrical engineering. |
| format | Article |
| id | doaj-art-b5d7414ea23a4d34a1e736670768c773 |
| institution | Kabale University |
| issn | 2542-5048 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | KeAi Communications Co., Ltd. |
| record_format | Article |
| series | Advanced Industrial and Engineering Polymer Research |
| spelling | doaj-art-b5d7414ea23a4d34a1e736670768c7732025-08-20T03:27:52ZengKeAi Communications Co., Ltd.Advanced Industrial and Engineering Polymer Research2542-50482025-07-018344345310.1016/j.aiepr.2025.05.005Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structuresQianshun Zhang0Wenzhuo Wu1Wenqi Zheng2Qi Huang3Zhanyu Zhou4Junpeng Wang5Xuerui Xiao6Hua Wang7Siwei Xiong8Luoxin Wang9Shiwen Yang10College of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaAerospace Science and Industry Corporation of Wuhan Magnetoelectricity Co., Ltd., Wuhan 430070, ChinaAerospace Science and Industry Corporation of Wuhan Magnetoelectricity Co., Ltd., Wuhan 430070, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, ChinaCollege of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, China; Corresponding author.College of Materials Science and Engineering, Hubei Provincial Engineering Center of Industrial Fiber Preparation and Application, Wuhan Textile University, Wuhan 430200, Hubei, China; Corresponding author.With rapid industrial development, effective thermal management has become essential for modern insulating materials. However, conventional aramid paper-based materials face substantial challenges in meeting these evolving demands due to their low thermal conductivity. This study demonstrates a novel fabrication method combining natural sedimentation filtration and thermal lamination to integrate hexagonal boron nitride (h-BN) into aramid/polyphenylene sulfide (PPS) composite paper, resulting in high thermal conductivity insulating aramid composite paper with a gradient structure and sandwich structure. At 60 wt% h-BN loading, the composite exhibits remarkable through-plane thermal conductivity (0.461 W/mK) and breakdown strength (40.96 kV/mm). These values show 255 % and 31.8 % improvements, respectively, over the h-BN-free control sample prepared under identical conditions. The thermal conductivity network formed by h-BN significantly enhances the TC of the composite. The exterior PPS film layer of the sandwich structure substantially augments the composite paper's resilience against thermal stress, chemical corrosion, and electromagnetic radiation. This enhanced durability renders the material highly promising for applications in various domains, including but not limited to electronics and electrical engineering.http://www.sciencedirect.com/science/article/pii/S254250482500020XAramid paper-based materialsPolyphenylene sulfideThermal conductivityInsulating propertiesGradient and sandwich structure |
| spellingShingle | Qianshun Zhang Wenzhuo Wu Wenqi Zheng Qi Huang Zhanyu Zhou Junpeng Wang Xuerui Xiao Hua Wang Siwei Xiong Luoxin Wang Shiwen Yang Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures Advanced Industrial and Engineering Polymer Research Aramid paper-based materials Polyphenylene sulfide Thermal conductivity Insulating properties Gradient and sandwich structure |
| title | Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures |
| title_full | Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures |
| title_fullStr | Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures |
| title_full_unstemmed | Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures |
| title_short | Highly thermally conductive and insulating aramid/polyphenylene sulfide composite paper with gradient and sandwich structures |
| title_sort | highly thermally conductive and insulating aramid polyphenylene sulfide composite paper with gradient and sandwich structures |
| topic | Aramid paper-based materials Polyphenylene sulfide Thermal conductivity Insulating properties Gradient and sandwich structure |
| url | http://www.sciencedirect.com/science/article/pii/S254250482500020X |
| work_keys_str_mv | AT qianshunzhang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT wenzhuowu highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT wenqizheng highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT qihuang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT zhanyuzhou highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT junpengwang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT xueruixiao highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT huawang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT siweixiong highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT luoxinwang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures AT shiwenyang highlythermallyconductiveandinsulatingaramidpolyphenylenesulfidecompositepaperwithgradientandsandwichstructures |