Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode
Recent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical inf...
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2025-05-01
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| author | Xinjian Pan Yunfei Duan Yi Song Cheng Peng Jinxuan Li Zhili Li Chunjian Deng Jianjun Yang Qingguo Gao Zhi Zhang Yi Cai |
| author_facet | Xinjian Pan Yunfei Duan Yi Song Cheng Peng Jinxuan Li Zhili Li Chunjian Deng Jianjun Yang Qingguo Gao Zhi Zhang Yi Cai |
| author_sort | Xinjian Pan |
| collection | DOAJ |
| description | Recent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical influences of point spacing, laser energy, and pulse number. Atomic force microscopy showed that 1 µm processing spacing enabled uniform ablation grooves with optimal roughness. Two-pulse configurations achieved the most consistent surface improvement. At 12.5 W incident power, samples exhibited minimized average roughness (219 nm) with localized values reaching 208 nm, alongside 1.2 N breaking stress. |
| format | Article |
| id | doaj-art-b4f375a3550a428d8c361ddd746a4fd6 |
| institution | OA Journals |
| issn | 2076-3417 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj-art-b4f375a3550a428d8c361ddd746a4fd62025-08-20T02:33:07ZengMDPI AGApplied Sciences2076-34172025-05-011511617210.3390/app15116172Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst ModeXinjian Pan0Yunfei Duan1Yi Song2Cheng Peng3Jinxuan Li4Zhili Li5Chunjian Deng6Jianjun Yang7Qingguo Gao8Zhi Zhang9Yi Cai10Zhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaZhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, ChinaShenzhen Key Laboratory of Micro/Nano Photonics and Information Technology, Optoelectronic Devices and Systems, College of Physics and Optoelectronic Engineering, Ministry of Education/Guangdong Province, State Key Lab Radio F, Shenzhen University, Shenzhen 518060, ChinaRecent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical influences of point spacing, laser energy, and pulse number. Atomic force microscopy showed that 1 µm processing spacing enabled uniform ablation grooves with optimal roughness. Two-pulse configurations achieved the most consistent surface improvement. At 12.5 W incident power, samples exhibited minimized average roughness (219 nm) with localized values reaching 208 nm, alongside 1.2 N breaking stress.https://www.mdpi.com/2076-3417/15/11/6172processing parametersglass-ceramicspicosecond laser |
| spellingShingle | Xinjian Pan Yunfei Duan Yi Song Cheng Peng Jinxuan Li Zhili Li Chunjian Deng Jianjun Yang Qingguo Gao Zhi Zhang Yi Cai Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode Applied Sciences processing parameters glass-ceramics picosecond laser |
| title | Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode |
| title_full | Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode |
| title_fullStr | Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode |
| title_full_unstemmed | Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode |
| title_short | Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode |
| title_sort | bessel picosecond laser cutting glass ceramics optimization of processing point spacing incident power and burst mode |
| topic | processing parameters glass-ceramics picosecond laser |
| url | https://www.mdpi.com/2076-3417/15/11/6172 |
| work_keys_str_mv | AT xinjianpan besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT yunfeiduan besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT yisong besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT chengpeng besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT jinxuanli besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT zhilili besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT chunjiandeng besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT jianjunyang besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT qingguogao besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT zhizhang besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode AT yicai besselpicosecondlasercuttingglassceramicsoptimizationofprocessingpointspacingincidentpowerandburstmode |