Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging

In this paper, micro-sized Zn particles were added into Sn-58Bi solder flux to form Sn-58Bi-xZn composite solder. The evolution of microstructure, interfacial IMCs and shearing properties during long-term aging were investigated. The wettability of Sn-58Bi-xZn solder decreased with the increase in Z...

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Bibliographic Details
Main Authors: Xin Yao, Shuang Tian, Minhao Zhou, Honghao Jiao, Jianfeng Wang, Bo Wang
Format: Article
Language:English
Published: Frontiers Media S.A. 2025-03-01
Series:Frontiers in Materials
Subjects:
Online Access:https://www.frontiersin.org/articles/10.3389/fmats.2025.1581900/full
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