A state-of-art review on SiC power module packaging and thermal management key technologies
Silicon carbide (SiC) power devices have advantages such as high withstanding voltage, fast switching speed, and low conduction losses. Therefore, they are gradually becoming core components of power conversion systems, especially in areas such as new energy vehicles, renewable energy, energy storag...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
|
| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.001 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | Silicon carbide (SiC) power devices have advantages such as high withstanding voltage, fast switching speed, and low conduction losses. Therefore, they are gradually becoming core components of power conversion systems, especially in areas such as new energy vehicles, renewable energy, energy storage, data centers, rail transit, and smart grids. Power devices applications are becoming increasingly wide-ranging. However, the continuous miniaturization and rapid increase in power density of SiC devices pose new challenges for power module packaging and thermal management. Traditional packaging structures and heat dissipation devices provide high thermal resistance, making it difficult to meet the high heat flux cooling requirements of SiC devices. Additionally, there is a growing demand for integrated heat dissipation packaging in high power density module. In response to the above challenges, this paper provided a detailed introduction and comparative analysis of typical power module packaging structures from both domestic and international sources. Different power module heat dissipation methods including their technical characteristics were enumerated and compared, such as heat spreaders, convective heat transfer, and phase change heat dissipation. Finally, based on previous researches on thermal packaging of SiC power modules, the challenges and future development trends in the next generation of SiC module packaging and thermal management technologies were discussed. |
|---|---|
| ISSN: | 1000-128X |