Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites
SiCp/7085 composites with 10% particle volume fraction was prepared by a semi-solid mixture-mechanical stirring-ultrasound vibrations method. The particle distribution and interface bonding were studied through optical microscopy (OM), scanning electron microscopy (SEM) and X-ray diffraction (XRD),...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Science Press
2017-02-01
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| Series: | 工程科学学报 |
| Subjects: | |
| Online Access: | http://cje.ustb.edu.cn/article/doi/10.13374/j.issn2095-9389.2017.02.011 |
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