APA (7th ed.) Citation

Kun, W., Li-hua, Z., Zheng-hua, L., Wen, J., & Chang-zi, L. Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites. Science Press.

Chicago Style (17th ed.) Citation

Kun, WANG, ZHANG Li-hua, LI Zheng-hua, JIANG Wen, and LI Chang-zi. Mechanism of Ultrasonic Field on the Particle Micro-agglomeration and Interfacial Bonding of SiCp/7085 Composites. Science Press.

MLA (9th ed.) Citation

Kun, WANG, et al. Mechanism of Ultrasonic Field on the Particle Micro-agglomeration and Interfacial Bonding of SiCp/7085 Composites. Science Press.