Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors

The lack of ultra-thin, controllable dielectric layers poses challenges for reducing power consumption in 2D FETs. In this study, plasma-enhanced atomic layer deposition was employed to fabricate a highly reliable, ultra-thin aluminum oxide (Al<sub>2</sub>O<sub>3</sub>) diele...

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Main Authors: Shiwei Sun, Dinghao Ma, Boxi Ye, Guanshun Liu, Nanting Luo, Hao Huang
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Journal of Low Power Electronics and Applications
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Online Access:https://www.mdpi.com/2079-9268/15/2/26
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author Shiwei Sun
Dinghao Ma
Boxi Ye
Guanshun Liu
Nanting Luo
Hao Huang
author_facet Shiwei Sun
Dinghao Ma
Boxi Ye
Guanshun Liu
Nanting Luo
Hao Huang
author_sort Shiwei Sun
collection DOAJ
description The lack of ultra-thin, controllable dielectric layers poses challenges for reducing power consumption in 2D FETs. In this study, plasma-enhanced atomic layer deposition was employed to fabricate a highly reliable, ultra-thin aluminum oxide (Al<sub>2</sub>O<sub>3</sub>) dielectric layer with a thickness of 4 nm. The Al<sub>2</sub>O<sub>3</sub> film grown on highly conductive silicon substrates demonstrated a maximum breakdown field of 5.98 MV/cm and a leakage current density as low as 2.48 × 10<sup>−7</sup> A/cm<sup>2</sup> at 1 MV/cm. MoS<sub>2</sub> FETs incorporating this Al<sub>2</sub>O<sub>3</sub> gate dielectric exhibited high-performance n-type characteristics at a low operating voltage of 1 V, achieving a subthreshold swing (SS) of 65 mV/dec, a threshold voltage (V<sub>th</sub>) of −0.96 V, a high carrier mobility (μ) of 34.85 cm<sup>2</sup>·V<sup>−1</sup>·s<sup>−1</sup>, and an on/off current ratio exceeding 10<sup>6</sup>. These results highlight the potential of Al<sub>2</sub>O<sub>3</sub> in enabling low-power 2D electronic devices for post-Moore applications.
format Article
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institution Kabale University
issn 2079-9268
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publishDate 2025-04-01
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series Journal of Low Power Electronics and Applications
spelling doaj-art-b0876e0fef504cf28058f58846c1ec9e2025-08-20T03:27:19ZengMDPI AGJournal of Low Power Electronics and Applications2079-92682025-04-011522610.3390/jlpea15020026Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect TransistorsShiwei Sun0Dinghao Ma1Boxi Ye2Guanshun Liu3Nanting Luo4Hao Huang5School of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaSchool of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaSchool of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaSchool of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaSchool of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaSchool of Resources, Environment and Materials, Guangxi University, Nanning 530004, ChinaThe lack of ultra-thin, controllable dielectric layers poses challenges for reducing power consumption in 2D FETs. In this study, plasma-enhanced atomic layer deposition was employed to fabricate a highly reliable, ultra-thin aluminum oxide (Al<sub>2</sub>O<sub>3</sub>) dielectric layer with a thickness of 4 nm. The Al<sub>2</sub>O<sub>3</sub> film grown on highly conductive silicon substrates demonstrated a maximum breakdown field of 5.98 MV/cm and a leakage current density as low as 2.48 × 10<sup>−7</sup> A/cm<sup>2</sup> at 1 MV/cm. MoS<sub>2</sub> FETs incorporating this Al<sub>2</sub>O<sub>3</sub> gate dielectric exhibited high-performance n-type characteristics at a low operating voltage of 1 V, achieving a subthreshold swing (SS) of 65 mV/dec, a threshold voltage (V<sub>th</sub>) of −0.96 V, a high carrier mobility (μ) of 34.85 cm<sup>2</sup>·V<sup>−1</sup>·s<sup>−1</sup>, and an on/off current ratio exceeding 10<sup>6</sup>. These results highlight the potential of Al<sub>2</sub>O<sub>3</sub> in enabling low-power 2D electronic devices for post-Moore applications.https://www.mdpi.com/2079-9268/15/2/26PEALDultra-thin dielectriclow-power devicesMOSFETs
spellingShingle Shiwei Sun
Dinghao Ma
Boxi Ye
Guanshun Liu
Nanting Luo
Hao Huang
Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
Journal of Low Power Electronics and Applications
PEALD
ultra-thin dielectric
low-power devices
MOSFETs
title Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
title_full Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
title_fullStr Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
title_full_unstemmed Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
title_short Ultra-Thin Al<sub>2</sub>O<sub>3</sub> Grown by PEALD for Low-Power Molybdenum Disulfide Field-Effect Transistors
title_sort ultra thin al sub 2 sub o sub 3 sub grown by peald for low power molybdenum disulfide field effect transistors
topic PEALD
ultra-thin dielectric
low-power devices
MOSFETs
url https://www.mdpi.com/2079-9268/15/2/26
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