Investigation of the mechanical properties of bio-composites based on loading kenaf fiber and molding process parameters
We aimed to obtain the mechanical properties of the resulting bio-composite material. Mechanical properties of bio-composite materials are greatly influenced by the fiber content and molding process parameters used. We used kenaf fiber as reinforcement and epoxy resin as a binder. Molding parameters...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIMS Press
2024-12-01
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| Series: | AIMS Materials Science |
| Subjects: | |
| Online Access: | https://www.aimspress.com/article/doi/10.3934/matersci.2024057 |
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| Summary: | We aimed to obtain the mechanical properties of the resulting bio-composite material. Mechanical properties of bio-composite materials are greatly influenced by the fiber content and molding process parameters used. We used kenaf fiber as reinforcement and epoxy resin as a binder. Molding parameters such as molding time, molding pressure, and molding temperature were implemented to get the best bio-composite material. We used two types of kenaf fibers at content of 20 wt.%, which consisted of long fiber (first filler) and short fiber (second filler) as reinforcement, at compositions of 10:10, 12.5:7.5, 15:5, and 17.5:2.5 based on weight percentage (wt.%), respectively. Our results showed that the fiber content and molding process parameters used had a significant effect on the resulting mechanical properties. The highest flexural strength value was obtained at a fiber content of 5 wt.%, amounting to 44.77 MPa. By applying the molding process parameters, the flexural strength value obtained was successfully increased up to 58 MPa at a molding pressure of 270 kg/cm2. The scanning electron microscope (SEM) results showed that the fiber content of 5 wt.% could be distributed well throughout the matrix, as well as increasing the molding pressure successfully reducing the voids formed during the molding process of the resulting bio-composite material. |
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| ISSN: | 2372-0484 |