Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a...

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Main Authors: A. Rape, X. Liu, A. Kulkarni, J. Singh
Format: Article
Language:English
Published: Wiley 2014-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2014/832308
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author A. Rape
X. Liu
A. Kulkarni
J. Singh
author_facet A. Rape
X. Liu
A. Kulkarni
J. Singh
author_sort A. Rape
collection DOAJ
description This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase. Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering. Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density. Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity.
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institution Kabale University
issn 1687-8434
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publishDate 2014-01-01
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series Advances in Materials Science and Engineering
spelling doaj-art-af941a0fbc9342abaab91de5730d66b92025-02-03T05:58:38ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422014-01-01201410.1155/2014/832308832308Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond CompositesA. Rape0X. Liu1A. Kulkarni2J. Singh3Applied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USAMomentive Performance Materials, 22557 Lunn Road, Strongsville, OH 44149, USADepartment of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, USAApplied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USAThis study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase. Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering. Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density. Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity.http://dx.doi.org/10.1155/2014/832308
spellingShingle A. Rape
X. Liu
A. Kulkarni
J. Singh
Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
Advances in Materials Science and Engineering
title Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
title_full Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
title_fullStr Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
title_full_unstemmed Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
title_short Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
title_sort effect of liquid phase additions on microstructure and thermal properties in copper and copper diamond composites
url http://dx.doi.org/10.1155/2014/832308
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