Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2014/832308 |
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| author | A. Rape X. Liu A. Kulkarni J. Singh |
| author_facet | A. Rape X. Liu A. Kulkarni J. Singh |
| author_sort | A. Rape |
| collection | DOAJ |
| description | This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase. Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering. Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density. Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity. |
| format | Article |
| id | doaj-art-af941a0fbc9342abaab91de5730d66b9 |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-af941a0fbc9342abaab91de5730d66b92025-02-03T05:58:38ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422014-01-01201410.1155/2014/832308832308Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond CompositesA. Rape0X. Liu1A. Kulkarni2J. Singh3Applied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USAMomentive Performance Materials, 22557 Lunn Road, Strongsville, OH 44149, USADepartment of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, USAApplied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USAThis study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase. Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering. Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density. Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity.http://dx.doi.org/10.1155/2014/832308 |
| spellingShingle | A. Rape X. Liu A. Kulkarni J. Singh Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites Advances in Materials Science and Engineering |
| title | Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites |
| title_full | Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites |
| title_fullStr | Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites |
| title_full_unstemmed | Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites |
| title_short | Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites |
| title_sort | effect of liquid phase additions on microstructure and thermal properties in copper and copper diamond composites |
| url | http://dx.doi.org/10.1155/2014/832308 |
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