Effect of ion energy and fluence on the electrical resistivity of silver implanted copper surface
Oxygen-free high thermal conductivity copper (OFHC) is widely used in accelerator beamlines due to its properties like high electrical and thermal conductivity, high impact strength, and high ductility. However, due to thermal stress, the properties of copper degrade with time. Small quantities of c...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425018393 |
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