APA (7th ed.) Citation

HUANG, W., HE, Y., XU, J., SONG, Z., HUANG, X., SUN, Y., & YU, X. Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw. Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.

Chicago Style (17th ed.) Citation

HUANG, Wei, Yanming HE, Jinbao XU, Zhenya SONG, Xiang HUANG, Yumeng SUN, and Ximeng YU. Design and Analysis of Spiral Plating Solution Flow and Rotating Magnetic Field Device for Electroplated Diamond Wire Saw. Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.

MLA (9th ed.) Citation

HUANG, Wei, et al. Design and Analysis of Spiral Plating Solution Flow and Rotating Magnetic Field Device for Electroplated Diamond Wire Saw. Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.