ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY
3-D finite element models of SOP( Small Outline Package) were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experim...
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Main Authors: | REN Chao, SHAO Jiang, ZENG ChenHui, XUE HePing |
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Format: | Article |
Language: | zho |
Published: |
Editorial Office of Journal of Mechanical Strength
2016-01-01
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Series: | Jixie qiangdu |
Subjects: | |
Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.03.030 |
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