Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test
In this study, the interfacial adhesion strength between copper (Cu) and dielectric films was investigated using laser spallation test. To quantitatively evaluate the interfacial strength, the compressive stress wave generated by laser pulse was precisely calibrated, and interface stress was analyze...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-08-01
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| Series: | Applied Surface Science Advances |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666523925000911 |
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