APA (7th ed.) Citation

Ju, Y., Kim, D., Lee, S., Kim, H., Lee, D., Hwang, Y., . . . Kim, H. Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test. Elsevier.

Chicago Style (17th ed.) Citation

Ju, Young-Min, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeon-Taek Hwang, Seung Hwan Lee, and Hak-Sung Kim. Measurement of Interfacial Adhesion Strength of Copper-Silicon Based Dielectric Interfaces via Laser Spallation Test. Elsevier.

MLA (9th ed.) Citation

Ju, Young-Min, et al. Measurement of Interfacial Adhesion Strength of Copper-Silicon Based Dielectric Interfaces via Laser Spallation Test. Elsevier.