Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells

P-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formation and were annealed subsequently at 950∼1050∘C for 30∼90 min for activation. Boron emitters were activated at 1000∘C or higher, while phosphorus emitters were activated at 950∘C. QSSPC measurements s...

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Main Authors: Hyunpil Boo, Jong-Han Lee, Min Gu Kang, KyungDong Lee, Seongtak Kim, Hae Chul Hwang, Wook Jung Hwang, Hee Oh Kang, Sungeun Park, Sung Ju Tark, Donghwan Kim
Format: Article
Language:English
Published: Wiley 2012-01-01
Series:International Journal of Photoenergy
Online Access:http://dx.doi.org/10.1155/2012/921908
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author Hyunpil Boo
Jong-Han Lee
Min Gu Kang
KyungDong Lee
Seongtak Kim
Hae Chul Hwang
Wook Jung Hwang
Hee Oh Kang
Sungeun Park
Sung Ju Tark
Donghwan Kim
author_facet Hyunpil Boo
Jong-Han Lee
Min Gu Kang
KyungDong Lee
Seongtak Kim
Hae Chul Hwang
Wook Jung Hwang
Hee Oh Kang
Sungeun Park
Sung Ju Tark
Donghwan Kim
author_sort Hyunpil Boo
collection DOAJ
description P-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formation and were annealed subsequently at 950∼1050∘C for 30∼90 min for activation. Boron emitters were activated at 1000∘C or higher, while phosphorus emitters were activated at 950∘C. QSSPC measurements show that the implied Voc of boron emitters increases about 15 mV and the J01 decreases by deep junction annealing even after the activation due to the reduced recombination in the emitter. However, for phosphorus emitters the implied Voc decreases from 622 mV to 560 mV and the J01 increases with deep junction annealing. This is due to the abrupt decrease in the bulk lifetime of the p-type wafer itself from 178 μs to 14 μs. PC1D simulation based on these results shows that, for p-type implanted solar cells, increasing the annealing temperature and time abruptly decreases the efficiency (Δηabs=−1.3%), while, for n-type implanted solar cells, deep junction annealing increases the efficiency and Voc, especially (Δηabs=+0.4%) for backside emitter solar cells.
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publishDate 2012-01-01
publisher Wiley
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series International Journal of Photoenergy
spelling doaj-art-aa9fd419f21547d08fc4a0850113e0612025-08-20T02:20:54ZengWileyInternational Journal of Photoenergy1110-662X1687-529X2012-01-01201210.1155/2012/921908921908Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar CellsHyunpil Boo0Jong-Han Lee1Min Gu Kang2KyungDong Lee3Seongtak Kim4Hae Chul Hwang5Wook Jung Hwang6Hee Oh Kang7Sungeun Park8Sung Ju Tark9Donghwan Kim10Department of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaNano-Process and Tech & Biz Division, National Nanofab Center, Daejeon 305-806, Republic of KoreaNano-Process and Tech & Biz Division, National Nanofab Center, Daejeon 305-806, Republic of KoreaNano-Process and Tech & Biz Division, National Nanofab Center, Daejeon 305-806, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of KoreaP-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formation and were annealed subsequently at 950∼1050∘C for 30∼90 min for activation. Boron emitters were activated at 1000∘C or higher, while phosphorus emitters were activated at 950∘C. QSSPC measurements show that the implied Voc of boron emitters increases about 15 mV and the J01 decreases by deep junction annealing even after the activation due to the reduced recombination in the emitter. However, for phosphorus emitters the implied Voc decreases from 622 mV to 560 mV and the J01 increases with deep junction annealing. This is due to the abrupt decrease in the bulk lifetime of the p-type wafer itself from 178 μs to 14 μs. PC1D simulation based on these results shows that, for p-type implanted solar cells, increasing the annealing temperature and time abruptly decreases the efficiency (Δηabs=−1.3%), while, for n-type implanted solar cells, deep junction annealing increases the efficiency and Voc, especially (Δηabs=+0.4%) for backside emitter solar cells.http://dx.doi.org/10.1155/2012/921908
spellingShingle Hyunpil Boo
Jong-Han Lee
Min Gu Kang
KyungDong Lee
Seongtak Kim
Hae Chul Hwang
Wook Jung Hwang
Hee Oh Kang
Sungeun Park
Sung Ju Tark
Donghwan Kim
Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
International Journal of Photoenergy
title Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
title_full Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
title_fullStr Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
title_full_unstemmed Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
title_short Effect of High-Temperature Annealing on Ion-Implanted Silicon Solar Cells
title_sort effect of high temperature annealing on ion implanted silicon solar cells
url http://dx.doi.org/10.1155/2012/921908
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