APA (7th ed.) Citation

Xu, P., Huang, H., Zhao, S., Liu, X., Zou, F., Li, C., . . . Liu, H. Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits. Elsevier.

Chicago Style (17th ed.) Citation

Xu, Peng, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, and Hui Liu. Applying the Carbon Materials in TSVs Array for Enhancing Heat Transfer Performance of Three-dimensional Integrated Circuits. Elsevier.

MLA (9th ed.) Citation

Xu, Peng, et al. Applying the Carbon Materials in TSVs Array for Enhancing Heat Transfer Performance of Three-dimensional Integrated Circuits. Elsevier.