Electrochemically-stimulated nanoscale mechanochemical wear of silicon

Abstract Mechanochemical reactions at the sliding interface between a single-crystalline silicon (Si) wafer and a silica (SiO2) microsphere were studied in three environmental conditions: humid air, potassium chloride (KCl) solution, and KCl solution with an applied voltage. Compared to that from hu...

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Main Authors: Chen Xiao, Stefan Van Vliet, Roland Bliem, Bart Weber, Steve Franklin
Format: Article
Language:English
Published: Tsinghua University Press 2023-06-01
Series:Friction
Subjects:
Online Access:https://doi.org/10.1007/s40544-023-0764-4
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author Chen Xiao
Stefan Van Vliet
Roland Bliem
Bart Weber
Steve Franklin
author_facet Chen Xiao
Stefan Van Vliet
Roland Bliem
Bart Weber
Steve Franklin
author_sort Chen Xiao
collection DOAJ
description Abstract Mechanochemical reactions at the sliding interface between a single-crystalline silicon (Si) wafer and a silica (SiO2) microsphere were studied in three environmental conditions: humid air, potassium chloride (KCl) solution, and KCl solution with an applied voltage. Compared to that from humid air, mechanochemical material removal from the silicon surface increased substantially in the KCl-immersed condition, and further increased when electrochemistry was introduced into the tribological system. By measuring the load dependence of the material removal rate and analyzing the results using a mechanically assisted Arrhenius-type kinetic model, the activation energy (E a) and the mechanical energy (E m), by which this energy is reduced by mechanical activation, were compared qualitatively under different environmental conditions. In the KCl-immersed condition, mechanochemistry may decrease the required effective energy of reactions (E eff = E a − E m) and promote material removal mainly through improved catalysis of the mechanochemical reactions facilitated by greater availability of water molecules compared to the humid air condition. Thus, the effectiveness of the mechanochemistry is improved. In the electrochemical condition, electrochemically-accelerated oxidation of the silicon surface was confirmed by the X-ray photoelectron spectroscopy (XPS) characterization. The results strongly suggest that electrochemistry further stimulates mechanochemical reactions primarily by increasing the initial energy state of the surface via the facilitated formation of interfacial bonding bridges, i.e., a surface oxidation/hydroxylation process.
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institution OA Journals
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language English
publishDate 2023-06-01
publisher Tsinghua University Press
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spelling doaj-art-a9a255ee4d2b4d03bd6628ffbcf7f0472025-08-20T02:00:46ZengTsinghua University PressFriction2223-76902223-77042023-06-0111112142215210.1007/s40544-023-0764-4Electrochemically-stimulated nanoscale mechanochemical wear of siliconChen Xiao0Stefan Van Vliet1Roland Bliem2Bart Weber3Steve Franklin4Advanced Research Center for Nanolithography (ARCNL)Advanced Research Center for Nanolithography (ARCNL)Advanced Research Center for Nanolithography (ARCNL)Advanced Research Center for Nanolithography (ARCNL)Advanced Research Center for Nanolithography (ARCNL)Abstract Mechanochemical reactions at the sliding interface between a single-crystalline silicon (Si) wafer and a silica (SiO2) microsphere were studied in three environmental conditions: humid air, potassium chloride (KCl) solution, and KCl solution with an applied voltage. Compared to that from humid air, mechanochemical material removal from the silicon surface increased substantially in the KCl-immersed condition, and further increased when electrochemistry was introduced into the tribological system. By measuring the load dependence of the material removal rate and analyzing the results using a mechanically assisted Arrhenius-type kinetic model, the activation energy (E a) and the mechanical energy (E m), by which this energy is reduced by mechanical activation, were compared qualitatively under different environmental conditions. In the KCl-immersed condition, mechanochemistry may decrease the required effective energy of reactions (E eff = E a − E m) and promote material removal mainly through improved catalysis of the mechanochemical reactions facilitated by greater availability of water molecules compared to the humid air condition. Thus, the effectiveness of the mechanochemistry is improved. In the electrochemical condition, electrochemically-accelerated oxidation of the silicon surface was confirmed by the X-ray photoelectron spectroscopy (XPS) characterization. The results strongly suggest that electrochemistry further stimulates mechanochemical reactions primarily by increasing the initial energy state of the surface via the facilitated formation of interfacial bonding bridges, i.e., a surface oxidation/hydroxylation process.https://doi.org/10.1007/s40544-023-0764-4spherical contactadhesive wearnormal loadingpower law
spellingShingle Chen Xiao
Stefan Van Vliet
Roland Bliem
Bart Weber
Steve Franklin
Electrochemically-stimulated nanoscale mechanochemical wear of silicon
Friction
spherical contact
adhesive wear
normal loading
power law
title Electrochemically-stimulated nanoscale mechanochemical wear of silicon
title_full Electrochemically-stimulated nanoscale mechanochemical wear of silicon
title_fullStr Electrochemically-stimulated nanoscale mechanochemical wear of silicon
title_full_unstemmed Electrochemically-stimulated nanoscale mechanochemical wear of silicon
title_short Electrochemically-stimulated nanoscale mechanochemical wear of silicon
title_sort electrochemically stimulated nanoscale mechanochemical wear of silicon
topic spherical contact
adhesive wear
normal loading
power law
url https://doi.org/10.1007/s40544-023-0764-4
work_keys_str_mv AT chenxiao electrochemicallystimulatednanoscalemechanochemicalwearofsilicon
AT stefanvanvliet electrochemicallystimulatednanoscalemechanochemicalwearofsilicon
AT rolandbliem electrochemicallystimulatednanoscalemechanochemicalwearofsilicon
AT bartweber electrochemicallystimulatednanoscalemechanochemicalwearofsilicon
AT stevefranklin electrochemicallystimulatednanoscalemechanochemicalwearofsilicon