Harnessing machine learning for high-throughput screening of high thermal conductivity polyimides: A multiscale feature engineering approach
Polyimides are known for their exceptional thermal stability and are widely utilized in high-temperature and electronic applications. To further explore and broaden their application in electronic packaging and thermal management, developing polyimide with high thermal conductivity remains a signifi...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Next Materials |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2949822824003174 |
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