Lee, B., Kim, K., & Kim, T. Analysis of Contact Noise Due to Elastic Recovery of Surface Asperities for Spherical Contact. MDPI AG.
Chicago Style (17th ed.) CitationLee, Bora, Kyungseob Kim, and Taewan Kim. Analysis of Contact Noise Due to Elastic Recovery of Surface Asperities for Spherical Contact. MDPI AG.
MLA (9th ed.) CitationLee, Bora, et al. Analysis of Contact Noise Due to Elastic Recovery of Surface Asperities for Spherical Contact. MDPI AG.
Warning: These citations may not always be 100% accurate.