An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs

High-electron mobility transistors (HEMTs) employing AlGaN/GaN heterostructures are suitable for high-power and high-frequency applications. To meet target specifications, GaN HEMTs must be designed and optimized by accurately considering the coupling of electrical and thermal characteristics, from...

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Main Authors: Yicong Dong, Eiji Yagyu, Takashi Matsuda, Koon Hoo Teo, Chungwei Lin, Shaloo Rakheja
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10836823/
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author Yicong Dong
Eiji Yagyu
Takashi Matsuda
Koon Hoo Teo
Chungwei Lin
Shaloo Rakheja
author_facet Yicong Dong
Eiji Yagyu
Takashi Matsuda
Koon Hoo Teo
Chungwei Lin
Shaloo Rakheja
author_sort Yicong Dong
collection DOAJ
description High-electron mobility transistors (HEMTs) employing AlGaN/GaN heterostructures are suitable for high-power and high-frequency applications. To meet target specifications, GaN HEMTs must be designed and optimized by accurately considering the coupling of electrical and thermal characteristics, from the static to the pulsed regimes of operation. Toward this, we implement an electro-thermal modeling and simulation framework for experimentally fabricated GaN on SiC HEMTs and use the framework to predict the high-temperature performance of the technology, up to 448 K. We utilize the transient measurement data at different ambient temperatures to extract the trap characteristics, which are important to understand from the RF dispersion perspective. Our work highlights the significance of the thermal boundary conditions at the source, drain, and gate metal electrodes and the impact of heat dissipation paths on the lattice temperature rise and I-V characteristics. Overall, our work provides a physical insight into the thermal response of GaN HEMTs and can facilitate suitable thermal management strategies of the device over a broad range of DC and transient operating conditions.
format Article
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institution Kabale University
issn 2168-6734
language English
publishDate 2025-01-01
publisher IEEE
record_format Article
series IEEE Journal of the Electron Devices Society
spelling doaj-art-a48b097ae408438d866e8d899287ebcd2025-01-28T00:00:33ZengIEEEIEEE Journal of the Electron Devices Society2168-67342025-01-0113546510.1109/JEDS.2025.352830710836823An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTsYicong Dong0https://orcid.org/0000-0002-1753-9737Eiji Yagyu1https://orcid.org/0009-0005-7966-3492Takashi Matsuda2Koon Hoo Teo3Chungwei Lin4https://orcid.org/0000-0003-1510-5414Shaloo Rakheja5https://orcid.org/0000-0001-7501-275XHolonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USAMitsubishi Electric Corporation, Advanced Technology R&D Center, Amagasaki, JapanMitsubishi Electric Corporation, Advanced Technology R&D Center, Amagasaki, JapanMitsubishi Electric Research Laboratories, Cambridge, MA, USAMitsubishi Electric Research Laboratories, Cambridge, MA, USAHolonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USAHigh-electron mobility transistors (HEMTs) employing AlGaN/GaN heterostructures are suitable for high-power and high-frequency applications. To meet target specifications, GaN HEMTs must be designed and optimized by accurately considering the coupling of electrical and thermal characteristics, from the static to the pulsed regimes of operation. Toward this, we implement an electro-thermal modeling and simulation framework for experimentally fabricated GaN on SiC HEMTs and use the framework to predict the high-temperature performance of the technology, up to 448 K. We utilize the transient measurement data at different ambient temperatures to extract the trap characteristics, which are important to understand from the RF dispersion perspective. Our work highlights the significance of the thermal boundary conditions at the source, drain, and gate metal electrodes and the impact of heat dissipation paths on the lattice temperature rise and I-V characteristics. Overall, our work provides a physical insight into the thermal response of GaN HEMTs and can facilitate suitable thermal management strategies of the device over a broad range of DC and transient operating conditions.https://ieeexplore.ieee.org/document/10836823/Gallium nitrideHEMTsthermodynamic transportTCAD simulationsdrain-current transients
spellingShingle Yicong Dong
Eiji Yagyu
Takashi Matsuda
Koon Hoo Teo
Chungwei Lin
Shaloo Rakheja
An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
IEEE Journal of the Electron Devices Society
Gallium nitride
HEMTs
thermodynamic transport
TCAD simulations
drain-current transients
title An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
title_full An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
title_fullStr An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
title_full_unstemmed An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
title_short An Accurate Electrical and Thermal Co-Simulation Framework for Modeling High-Temperature DC and Pulsed I - V Characteristics of GaN HEMTs
title_sort accurate electrical and thermal co simulation framework for modeling high temperature dc and pulsed i v characteristics of gan hemts
topic Gallium nitride
HEMTs
thermodynamic transport
TCAD simulations
drain-current transients
url https://ieeexplore.ieee.org/document/10836823/
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