Study on Properties of Heat-Resistant Hybrid Resin Containing Silicon and Composites
In recent years, one kind of novel hybrid polymer containing silicon has already been reported in the field of high-temperature resistance polymer. Gradually, it has been a research hotspot in the field of high-performance matrix resins because of excellent heat resistance and dielectric properties....
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2020-01-01
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| Series: | International Journal of Polymer Science |
| Online Access: | http://dx.doi.org/10.1155/2020/4591028 |
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| Summary: | In recent years, one kind of novel hybrid polymer containing silicon has already been reported in the field of high-temperature resistance polymer. Gradually, it has been a research hotspot in the field of high-performance matrix resins because of excellent heat resistance and dielectric properties. The composite was prepared by M-aminophenylacetylene terminated polymethyldiphenylethynyl silane (MDPES-2) as a matrix and nonalkali glass cloth as reinforced material using a hot press process. The cure reaction of MDPES-2 was characterized. Meanwhile, heat resistance, mechanical properties, and dielectric properties of MDPES-2 composites were systematically studied in this paper. The results showed that flexural strength at room temperature is 321 MPa and flexural strength retention at 240°C was 98.3%. Flexural strength retention after thermal treatment at 500°C for 7 min was 84%. In addition, ε and dielectric dissipation factor (tanδ) were 3.9 and 2.0×10−3 (10 GHz). |
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| ISSN: | 1687-9422 1687-9430 |