Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review
With the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore’s Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical l...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/4/431 |
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