Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review
With the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore’s Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical l...
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MDPI AG
2025-04-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/16/4/431 |
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| author | Guoliang Chen Guiqi Wang Zhenzhen Wang Lijun Wang |
| author_facet | Guoliang Chen Guiqi Wang Zhenzhen Wang Lijun Wang |
| author_sort | Guoliang Chen |
| collection | DOAJ |
| description | With the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore’s Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical limits. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage, bumps’ reliability, through-silicon vias’ (TSVs) and redistribution layers’ (RDLs) reliability, and thermal dissipation, etc. Glass, with its superior mechanical, thermal, electrical, and optical properties, is emerging as a promising material to address these challenges, particularly with the development of femtosecond laser technology. This paper discusses the evolution of both conventional and advanced packaging technologies and outlines future directions for design, fabrication, and packaging using glass substrates and femtosecond laser processing. |
| format | Article |
| id | doaj-art-a06f700508214ea4bf486a9ffc1570af |
| institution | OA Journals |
| issn | 2072-666X |
| language | English |
| publishDate | 2025-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-a06f700508214ea4bf486a9ffc1570af2025-08-20T02:18:04ZengMDPI AGMicromachines2072-666X2025-04-0116443110.3390/mi16040431Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A ReviewGuoliang Chen0Guiqi Wang1Zhenzhen Wang2Lijun Wang3Hangzhou Institute of Technology, Xidian University, Hangzhou 311231, ChinaHangzhou Institute of Technology, Xidian University, Hangzhou 311231, ChinaHangzhou Institute of Technology, Xidian University, Hangzhou 311231, ChinaHangzhou Institute of Technology, Xidian University, Hangzhou 311231, ChinaWith the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore’s Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical limits. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage, bumps’ reliability, through-silicon vias’ (TSVs) and redistribution layers’ (RDLs) reliability, and thermal dissipation, etc. Glass, with its superior mechanical, thermal, electrical, and optical properties, is emerging as a promising material to address these challenges, particularly with the development of femtosecond laser technology. This paper discusses the evolution of both conventional and advanced packaging technologies and outlines future directions for design, fabrication, and packaging using glass substrates and femtosecond laser processing.https://www.mdpi.com/2072-666X/16/4/431semiconductor conventional and advanced packagefan-out2D, 2.5D and 3D packageinterposerchipletsco-packaged optics |
| spellingShingle | Guoliang Chen Guiqi Wang Zhenzhen Wang Lijun Wang Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review Micromachines semiconductor conventional and advanced package fan-out 2D, 2.5D and 3D package interposer chiplets co-packaged optics |
| title | Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review |
| title_full | Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review |
| title_fullStr | Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review |
| title_full_unstemmed | Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review |
| title_short | Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review |
| title_sort | electronic chip package and co packaged optics cpo technology for modern ai era a review |
| topic | semiconductor conventional and advanced package fan-out 2D, 2.5D and 3D package interposer chiplets co-packaged optics |
| url | https://www.mdpi.com/2072-666X/16/4/431 |
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