Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength
The dispersoid precipitation behavior during the solutionizing and aging of Al-xwt.%Cu-1.0 wt.% Mn alloys (x = 2.0, 4.5, and 7.5) and contribution to mechanical properties were investigated using tensile testing and microstructural characterization. A shell-core structure of primary α-Al dendrites i...
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2018-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2018/6741502 |
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| author | Jinlong Chen Hengcheng Liao Heting Xu |
| author_facet | Jinlong Chen Hengcheng Liao Heting Xu |
| author_sort | Jinlong Chen |
| collection | DOAJ |
| description | The dispersoid precipitation behavior during the solutionizing and aging of Al-xwt.%Cu-1.0 wt.% Mn alloys (x = 2.0, 4.5, and 7.5) and contribution to mechanical properties were investigated using tensile testing and microstructural characterization. A shell-core structure of primary α-Al dendrites is found in Al-Cu-Mn alloys, in which the Cu content in the shell is higher than that in the core. The area of shell zone (Cu-rich) increases with an increase in Cu content in the alloy. Large amounts of fine dispersoid Al-Cu-Mn particles precipitate in solution. An alloy with low Cu content results in only the TMn (Al20Cu2Mn3) particles being precipitated. However, in an alloy with high Cu content, AlCu3Mn2 particles are first found to precipitate beside TMn. However, this precipitation behavior is uneven. The precipitation zones in the solution microstructure are consistent with the Cu-rich regions in the as-cast microstructure. A number of fine particles (dozens nanometer in size) are first found to precipitate on the rod-like TMn particles during the aging phase. The redissolution and granulation of the eutectic CuAl2 phase during the solutionizing process result in the formation of particle-free bands between the precipitation zones. The tension test at 300°C demonstrates that the increase in high temperature strength is due to the dispersoid precipitation during solutionizing, and the precipitation behavior in the aging phase has little or no effect, however, largely improves the tensile strength at room temperature. High temperature strength is significantly increased with an increase in Cu content, which correlates to an increase in number and decrease in size of TMn and AlCu3Mn2 particles. |
| format | Article |
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| institution | OA Journals |
| issn | 1687-8434 1687-8442 |
| language | English |
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| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-a05fc3d5a5ef46149083e255b9129ebd2025-08-20T02:20:51ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422018-01-01201810.1155/2018/67415026741502Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature StrengthJinlong Chen0Hengcheng Liao1Heting Xu2School of Materials Science and Engineering, Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Nanjing 211189, ChinaSchool of Materials Science and Engineering, Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Nanjing 211189, ChinaSchool of Materials Science and Engineering, Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Nanjing 211189, ChinaThe dispersoid precipitation behavior during the solutionizing and aging of Al-xwt.%Cu-1.0 wt.% Mn alloys (x = 2.0, 4.5, and 7.5) and contribution to mechanical properties were investigated using tensile testing and microstructural characterization. A shell-core structure of primary α-Al dendrites is found in Al-Cu-Mn alloys, in which the Cu content in the shell is higher than that in the core. The area of shell zone (Cu-rich) increases with an increase in Cu content in the alloy. Large amounts of fine dispersoid Al-Cu-Mn particles precipitate in solution. An alloy with low Cu content results in only the TMn (Al20Cu2Mn3) particles being precipitated. However, in an alloy with high Cu content, AlCu3Mn2 particles are first found to precipitate beside TMn. However, this precipitation behavior is uneven. The precipitation zones in the solution microstructure are consistent with the Cu-rich regions in the as-cast microstructure. A number of fine particles (dozens nanometer in size) are first found to precipitate on the rod-like TMn particles during the aging phase. The redissolution and granulation of the eutectic CuAl2 phase during the solutionizing process result in the formation of particle-free bands between the precipitation zones. The tension test at 300°C demonstrates that the increase in high temperature strength is due to the dispersoid precipitation during solutionizing, and the precipitation behavior in the aging phase has little or no effect, however, largely improves the tensile strength at room temperature. High temperature strength is significantly increased with an increase in Cu content, which correlates to an increase in number and decrease in size of TMn and AlCu3Mn2 particles.http://dx.doi.org/10.1155/2018/6741502 |
| spellingShingle | Jinlong Chen Hengcheng Liao Heting Xu Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength Advances in Materials Science and Engineering |
| title | Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength |
| title_full | Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength |
| title_fullStr | Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength |
| title_full_unstemmed | Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength |
| title_short | Uneven Precipitation Behavior during the Solutionizing Course of Al-Cu-Mn Alloys and Their Contribution to High Temperature Strength |
| title_sort | uneven precipitation behavior during the solutionizing course of al cu mn alloys and their contribution to high temperature strength |
| url | http://dx.doi.org/10.1155/2018/6741502 |
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