Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits
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| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1983-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.10.209 |
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| _version_ | 1832565043952091136 |
|---|---|
| author | Ch. Zimmer |
| author_facet | Ch. Zimmer |
| author_sort | Ch. Zimmer |
| collection | DOAJ |
| format | Article |
| id | doaj-art-9f09a386faf9403ebdd8b3e53ba652b6 |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 1983-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-9f09a386faf9403ebdd8b3e53ba652b62025-02-03T01:09:39ZengWileyActive and Passive Electronic Components0882-75161563-50311983-01-0110420921610.1155/APEC.10.209Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital CircuitsCh. Zimmerhttp://dx.doi.org/10.1155/APEC.10.209 |
| spellingShingle | Ch. Zimmer Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits Active and Passive Electronic Components |
| title | Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits |
| title_full | Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits |
| title_fullStr | Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits |
| title_full_unstemmed | Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits |
| title_short | Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits |
| title_sort | versatile packaging concept using thick film hybrids for analog and digital circuits |
| url | http://dx.doi.org/10.1155/APEC.10.209 |
| work_keys_str_mv | AT chzimmer versatilepackagingconceptusingthickfilmhybridsforanaloganddigitalcircuits |