Impact of voids on the solder joint integrity and fatigue life of IGBT power module
Insulated gate bipolar transistor (IGBT) power module is a key component of actuator devices in many systems which include electric vehicles (EVs). However, as the deployment of IGBT modules penetrates several mission-critical systems operating in harsher ambient, process voids in the solder joints...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-06-01
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| Series: | Power Electronic Devices and Components |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370425000239 |
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| author | Sunday E. Nebo Emeka H. Amalu David J. Hughes |
| author_facet | Sunday E. Nebo Emeka H. Amalu David J. Hughes |
| author_sort | Sunday E. Nebo |
| collection | DOAJ |
| description | Insulated gate bipolar transistor (IGBT) power module is a key component of actuator devices in many systems which include electric vehicles (EVs). However, as the deployment of IGBT modules penetrates several mission-critical systems operating in harsher ambient, process voids in the solder joints challenge their reliability and fatigue life. This investigation quantifies the impact of presence of 10% voids in critical solder joints on the integrity and fatigue-life of IGBT module for reliable field operation. Computational modelling utilising python programming algorithm deployed in Monte-Carlo technique is used to generate realist distributions of spatial random voids on three representative volume elements (RVEs) of critical solder joints in three IGBT modules. The three modules have elliptical voids, spherical voids and a combination of elliptical and spherical voids, respectively. A fourth control module has no void. Solder joints in the models comprises 96.5% tin, 3.0% silver, and 0.5% copper (SAC305). The IEC 60068-2-14 temperature load cycle and Anand’s visco-plastic model are employed as the load and constitutive model, respectively. Other component materials are modelled with appropriate time and temperature dependent models and material properties. Combined elliptical and spherical voids induced the highest damage while elliptical voids induced the highest plastic strain of 0.045 µm/µm magnitude in the joints. Accumulated stress and strain energy have magnitudes of 74.05 MPa and 2.63 × 105 pJ, respectively. Ten percent elliptical voids in the joints reduced the fatigue life of the module by 59.5%. |
| format | Article |
| id | doaj-art-9db3d3ef4f104ca2bb58773b4d1c8d63 |
| institution | OA Journals |
| issn | 2772-3704 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Power Electronic Devices and Components |
| spelling | doaj-art-9db3d3ef4f104ca2bb58773b4d1c8d632025-08-20T02:33:42ZengElsevierPower Electronic Devices and Components2772-37042025-06-011110009810.1016/j.pedc.2025.100098Impact of voids on the solder joint integrity and fatigue life of IGBT power moduleSunday E. Nebo0Emeka H. Amalu1David J. Hughes2Corresponding author.; Department of Engineering, School of Computing, Engineering and Digital Technologies, Teesside University, Middlesbrough, Cleveland, TS1 3BA, UKDepartment of Engineering, School of Computing, Engineering and Digital Technologies, Teesside University, Middlesbrough, Cleveland, TS1 3BA, UKDepartment of Engineering, School of Computing, Engineering and Digital Technologies, Teesside University, Middlesbrough, Cleveland, TS1 3BA, UKInsulated gate bipolar transistor (IGBT) power module is a key component of actuator devices in many systems which include electric vehicles (EVs). However, as the deployment of IGBT modules penetrates several mission-critical systems operating in harsher ambient, process voids in the solder joints challenge their reliability and fatigue life. This investigation quantifies the impact of presence of 10% voids in critical solder joints on the integrity and fatigue-life of IGBT module for reliable field operation. Computational modelling utilising python programming algorithm deployed in Monte-Carlo technique is used to generate realist distributions of spatial random voids on three representative volume elements (RVEs) of critical solder joints in three IGBT modules. The three modules have elliptical voids, spherical voids and a combination of elliptical and spherical voids, respectively. A fourth control module has no void. Solder joints in the models comprises 96.5% tin, 3.0% silver, and 0.5% copper (SAC305). The IEC 60068-2-14 temperature load cycle and Anand’s visco-plastic model are employed as the load and constitutive model, respectively. Other component materials are modelled with appropriate time and temperature dependent models and material properties. Combined elliptical and spherical voids induced the highest damage while elliptical voids induced the highest plastic strain of 0.045 µm/µm magnitude in the joints. Accumulated stress and strain energy have magnitudes of 74.05 MPa and 2.63 × 105 pJ, respectively. Ten percent elliptical voids in the joints reduced the fatigue life of the module by 59.5%.http://www.sciencedirect.com/science/article/pii/S2772370425000239Insulated Gate Bipolar Transistor (IGBT)Poly-shape VoidsPower electronics moduleThermo-mechanical reliabilityVoid morphologyPython programming algorithm |
| spellingShingle | Sunday E. Nebo Emeka H. Amalu David J. Hughes Impact of voids on the solder joint integrity and fatigue life of IGBT power module Power Electronic Devices and Components Insulated Gate Bipolar Transistor (IGBT) Poly-shape Voids Power electronics module Thermo-mechanical reliability Void morphology Python programming algorithm |
| title | Impact of voids on the solder joint integrity and fatigue life of IGBT power module |
| title_full | Impact of voids on the solder joint integrity and fatigue life of IGBT power module |
| title_fullStr | Impact of voids on the solder joint integrity and fatigue life of IGBT power module |
| title_full_unstemmed | Impact of voids on the solder joint integrity and fatigue life of IGBT power module |
| title_short | Impact of voids on the solder joint integrity and fatigue life of IGBT power module |
| title_sort | impact of voids on the solder joint integrity and fatigue life of igbt power module |
| topic | Insulated Gate Bipolar Transistor (IGBT) Poly-shape Voids Power electronics module Thermo-mechanical reliability Void morphology Python programming algorithm |
| url | http://www.sciencedirect.com/science/article/pii/S2772370425000239 |
| work_keys_str_mv | AT sundayenebo impactofvoidsonthesolderjointintegrityandfatiguelifeofigbtpowermodule AT emekahamalu impactofvoidsonthesolderjointintegrityandfatiguelifeofigbtpowermodule AT davidjhughes impactofvoidsonthesolderjointintegrityandfatiguelifeofigbtpowermodule |