Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane
Abstract Passive thermal management in electronics has disadvantages of low efficiency and high cost. Herein, experimental and numerical studies on the geometric optimization of a hygroscopic‐membrane heat sink (HMHS) are conducted. The HMHS is based on water evaporation from a membrane‐encapsulated...
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| Format: | Article |
| Language: | English |
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Wiley
2025-02-01
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| Series: | Carbon Energy |
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| Online Access: | https://doi.org/10.1002/cey2.665 |
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| author | Zengguang Sui Fuxiang Li Yunren Sui Haosheng Lin Wei Wu |
| author_facet | Zengguang Sui Fuxiang Li Yunren Sui Haosheng Lin Wei Wu |
| author_sort | Zengguang Sui |
| collection | DOAJ |
| description | Abstract Passive thermal management in electronics has disadvantages of low efficiency and high cost. Herein, experimental and numerical studies on the geometric optimization of a hygroscopic‐membrane heat sink (HMHS) are conducted. The HMHS is based on water evaporation from a membrane‐encapsulated hygroscopic salt solution, in which pin fins are used for thermal conductivity enhancement. A comprehensive heat and mass transfer model is developed and validated. To obtain the HMHS configuration with the maximum cooling performance, an approach that couples the Taguchi method with numerical simulations is utilized. The contribution ratio of each design factor is determined. Experimentally validated results demonstrate that the maximum temperature reduction provided by the HMHS can be further improved from 15.5°C to 17.8°C after optimization, achieving a temperature reduction of up to 21°C at a fixed heat flux of 25 kW/m2 when compared with a similarly sized fin heat sink. Remarkably, the optimized HMHS extends the effective cooling time by ∼343% compared with traditional phase‐change materials, achieving a maximum temperature reduction ranging from 7.0°C to 20.4°C. Meanwhile, the effective heat transfer coefficient achieved is comparable with that of forced liquid cooling. Our findings suggest that the proposed cooling approach provides a new pathway for intermittent thermal management, which is expected to be used for thermal regulation of electronics, batteries, photovoltaic panels, and LED lights. |
| format | Article |
| id | doaj-art-9ce91b6bba31478a9191cd28acb1a165 |
| institution | DOAJ |
| issn | 2637-9368 |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Wiley |
| record_format | Article |
| series | Carbon Energy |
| spelling | doaj-art-9ce91b6bba31478a9191cd28acb1a1652025-08-20T02:45:46ZengWileyCarbon Energy2637-93682025-02-0172n/an/a10.1002/cey2.665Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membraneZengguang Sui0Fuxiang Li1Yunren Sui2Haosheng Lin3Wei Wu4School of Energy and Environment City University of Hong Kong Hong Kong ChinaSchool of Energy and Environment City University of Hong Kong Hong Kong ChinaSchool of Energy and Environment City University of Hong Kong Hong Kong ChinaSchool of Energy and Environment City University of Hong Kong Hong Kong ChinaSchool of Energy and Environment City University of Hong Kong Hong Kong ChinaAbstract Passive thermal management in electronics has disadvantages of low efficiency and high cost. Herein, experimental and numerical studies on the geometric optimization of a hygroscopic‐membrane heat sink (HMHS) are conducted. The HMHS is based on water evaporation from a membrane‐encapsulated hygroscopic salt solution, in which pin fins are used for thermal conductivity enhancement. A comprehensive heat and mass transfer model is developed and validated. To obtain the HMHS configuration with the maximum cooling performance, an approach that couples the Taguchi method with numerical simulations is utilized. The contribution ratio of each design factor is determined. Experimentally validated results demonstrate that the maximum temperature reduction provided by the HMHS can be further improved from 15.5°C to 17.8°C after optimization, achieving a temperature reduction of up to 21°C at a fixed heat flux of 25 kW/m2 when compared with a similarly sized fin heat sink. Remarkably, the optimized HMHS extends the effective cooling time by ∼343% compared with traditional phase‐change materials, achieving a maximum temperature reduction ranging from 7.0°C to 20.4°C. Meanwhile, the effective heat transfer coefficient achieved is comparable with that of forced liquid cooling. Our findings suggest that the proposed cooling approach provides a new pathway for intermittent thermal management, which is expected to be used for thermal regulation of electronics, batteries, photovoltaic panels, and LED lights.https://doi.org/10.1002/cey2.665electronicshygroscopic solutionmembraneoptimizationpassive thermal managementTaguchi method |
| spellingShingle | Zengguang Sui Fuxiang Li Yunren Sui Haosheng Lin Wei Wu Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane Carbon Energy electronics hygroscopic solution membrane optimization passive thermal management Taguchi method |
| title | Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane |
| title_full | Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane |
| title_fullStr | Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane |
| title_full_unstemmed | Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane |
| title_short | Ultra‐high‐flux passive cooling enabled by a sweating‐inspired hygroscopic membrane |
| title_sort | ultra high flux passive cooling enabled by a sweating inspired hygroscopic membrane |
| topic | electronics hygroscopic solution membrane optimization passive thermal management Taguchi method |
| url | https://doi.org/10.1002/cey2.665 |
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