Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips
1-dimensional metal and semiconductor nanostructures exhibit interesting physical properties, but their integration into modern electronic devices is often a very challenging task. Finding the appropriate supports for nanostructures and nanoscale contacts are highly desired aspects in this regard. I...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2012-01-01
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| Series: | Journal of Nanotechnology |
| Online Access: | http://dx.doi.org/10.1155/2012/325732 |
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| _version_ | 1849404656756719616 |
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| author | Dawit Gedamu Ingo Paulowicz Seid Jebril Yogendra Kumar Mishra Rainer Adelung |
| author_facet | Dawit Gedamu Ingo Paulowicz Seid Jebril Yogendra Kumar Mishra Rainer Adelung |
| author_sort | Dawit Gedamu |
| collection | DOAJ |
| description | 1-dimensional metal and semiconductor nanostructures exhibit interesting physical properties, but their integration into modern electronic devices is often a very challenging task. Finding the appropriate supports for nanostructures and nanoscale contacts are highly desired aspects in this regard. In present work we demonstrate the fabrication of 1D nano- and mesostructures between microstructured contacts formed directly on a silicon chip either by a thin film fracture (TFF) approach or by a modified vapor-liquid-solid (MVLS) approach. In principle, both approaches offer the possibilities to integrate these nano-meso structures in wafer-level fabrications. Electrical properties of these nano-micro structures integrated on Si chips and their preliminary applications in the direction of sensors and field effect transistors are also presented. |
| format | Article |
| id | doaj-art-9bb7da94c41f4731957183dca22d9bfe |
| institution | Kabale University |
| issn | 1687-9503 1687-9511 |
| language | English |
| publishDate | 2012-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Journal of Nanotechnology |
| spelling | doaj-art-9bb7da94c41f4731957183dca22d9bfe2025-08-20T03:36:54ZengWileyJournal of Nanotechnology1687-95031687-95112012-01-01201210.1155/2012/325732325732Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si ChipsDawit Gedamu0Ingo Paulowicz1Seid Jebril2Yogendra Kumar Mishra3Rainer Adelung4Functional Nanomaterials, Institute for Materials Science, Christian-Albrechts-University Kiel, Kaiserstraβe 2, 24143 Kiel, GermanyFunctional Nanomaterials, Institute for Materials Science, Christian-Albrechts-University Kiel, Kaiserstraβe 2, 24143 Kiel, GermanyMulticomponent Materials, Institute for Materials Science, Christian-Albrechts-University Kiel, Kaiserstraβe 2, 24143 Kiel, GermanyFunctional Nanomaterials, Institute for Materials Science, Christian-Albrechts-University Kiel, Kaiserstraβe 2, 24143 Kiel, GermanyFunctional Nanomaterials, Institute for Materials Science, Christian-Albrechts-University Kiel, Kaiserstraβe 2, 24143 Kiel, Germany1-dimensional metal and semiconductor nanostructures exhibit interesting physical properties, but their integration into modern electronic devices is often a very challenging task. Finding the appropriate supports for nanostructures and nanoscale contacts are highly desired aspects in this regard. In present work we demonstrate the fabrication of 1D nano- and mesostructures between microstructured contacts formed directly on a silicon chip either by a thin film fracture (TFF) approach or by a modified vapor-liquid-solid (MVLS) approach. In principle, both approaches offer the possibilities to integrate these nano-meso structures in wafer-level fabrications. Electrical properties of these nano-micro structures integrated on Si chips and their preliminary applications in the direction of sensors and field effect transistors are also presented.http://dx.doi.org/10.1155/2012/325732 |
| spellingShingle | Dawit Gedamu Ingo Paulowicz Seid Jebril Yogendra Kumar Mishra Rainer Adelung Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips Journal of Nanotechnology |
| title | Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips |
| title_full | Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips |
| title_fullStr | Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips |
| title_full_unstemmed | Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips |
| title_short | Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips |
| title_sort | procedures and properties for a direct nano micro integration of metal and semiconductor nanowires on si chips |
| url | http://dx.doi.org/10.1155/2012/325732 |
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