Low-temperature pulsed-light assembly of nanoparticle silver ink
The precision printing of high-conductivity metals is a foundational technology for the realization of additively manufactured electronics integration. For many applications, the quality of the printed metal is a result of a competition between the energetics of metal nanoparticle ink sin...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Academia.edu Journals
2023-11-01
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| Series: | Academia Materials Science |
| Online Access: | https://www.academia.edu/109240607/Low_temperature_Pulsed_Light_Assembly_of_Nanoparticle_Silver_Ink |
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| Summary: | The precision printing of high-conductivity metals is a foundational technology for the realization of additively manufactured electronics integration. For many applications, the quality of the printed metal is a result of a competition between the energetics of metal nanoparticle ink sintering and the tolerance of the active device and substrate materials to sintering conditions. In this work, a quantitative investigation of a novel pulsed-light low-temperature sintering process of silver nanoparticle ink that results in conductivity values competitive with processes requiring temperatures of 150°C or higher is presented. Experimentally determined conductivities are correlated with measured grain sizes, compositions and stoichiometries, and candidate oxide coverages. The impact of dense, uniform, and aligned grains on the observed conductivities is explored. |
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| ISSN: | 2997-2027 |