Advanced Design for High-Performance and AI Chips
Highlights A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2025-07-01
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| Series: | Nano-Micro Letters |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40820-025-01850-w |
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| _version_ | 1849343612876226560 |
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| author | Ying Cao Yuejiao Chen Xi Fan Hong Fu Bingang Xu |
| author_facet | Ying Cao Yuejiao Chen Xi Fan Hong Fu Bingang Xu |
| author_sort | Ying Cao |
| collection | DOAJ |
| description | Highlights A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward. |
| format | Article |
| id | doaj-art-99cafd21d97a4aca907c841bf0e6b61b |
| institution | Kabale University |
| issn | 2311-6706 2150-5551 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Nano-Micro Letters |
| spelling | doaj-art-99cafd21d97a4aca907c841bf0e6b61b2025-08-20T03:42:56ZengSpringerOpenNano-Micro Letters2311-67062150-55512025-07-0118113110.1007/s40820-025-01850-wAdvanced Design for High-Performance and AI ChipsYing Cao0Yuejiao Chen1Xi Fan2Hong Fu3Bingang Xu4Nanotechnology Center, School of Fashion and Textiles, The Hong Kong Polytechnic UniversityState Key Laboratory for Powder Metallurgy, Central South UniversityNingbo Institute of Materials Technology and Engineering, Chinese Academy of SciencesDepartment of Mathematics and Information Technology, The Education University of Hong KongNanotechnology Center, School of Fashion and Textiles, The Hong Kong Polytechnic UniversityHighlights A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward.https://doi.org/10.1007/s40820-025-01850-wArtificial intelligenceAdvanced chipsAI chipsDesign tacticsReview and perspective |
| spellingShingle | Ying Cao Yuejiao Chen Xi Fan Hong Fu Bingang Xu Advanced Design for High-Performance and AI Chips Nano-Micro Letters Artificial intelligence Advanced chips AI chips Design tactics Review and perspective |
| title | Advanced Design for High-Performance and AI Chips |
| title_full | Advanced Design for High-Performance and AI Chips |
| title_fullStr | Advanced Design for High-Performance and AI Chips |
| title_full_unstemmed | Advanced Design for High-Performance and AI Chips |
| title_short | Advanced Design for High-Performance and AI Chips |
| title_sort | advanced design for high performance and ai chips |
| topic | Artificial intelligence Advanced chips AI chips Design tactics Review and perspective |
| url | https://doi.org/10.1007/s40820-025-01850-w |
| work_keys_str_mv | AT yingcao advanceddesignforhighperformanceandaichips AT yuejiaochen advanceddesignforhighperformanceandaichips AT xifan advanceddesignforhighperformanceandaichips AT hongfu advanceddesignforhighperformanceandaichips AT bingangxu advanceddesignforhighperformanceandaichips |