Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue
The Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue. During isothermal aging, the size of Sn grain and...
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Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029193 |
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| author | Junjie Zhao Jun Wu Jiayu Zhang Mingqin Liao Fengjiang Wang |
| author_facet | Junjie Zhao Jun Wu Jiayu Zhang Mingqin Liao Fengjiang Wang |
| author_sort | Junjie Zhao |
| collection | DOAJ |
| description | The Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue. During isothermal aging, the size of Sn grain and intermetallic compound (IMC) thickness in solder joints were greatly decreased due to the addition of Bi, especially with 5 wt% addition because the atomic migration to produce IMC layer was hindered by the Bi diffusion layer formed at the IMC interface, which means that Bi can play a role in refining the grains. Meanwhile, the shear strength of Sn-1.0Ag-0.5Cu-xBi solder joints was greatly improved through solid solution strengthening. During thermal cycling, electron backscatter diffraction analysis showed that Bi addition increased the tendency of grains to slip, as indicated by a higher Schmid factor. The thermal fatigue failure modes of micro solder joints with various Bi contents were different. In the absence of Bi addition, the fracture mode of the solder joint was typical transgranular fracture mode. With the addition ofBi element, the solder joints showed an intergranular fracture mode. The addition of Bi provides more heterogeneous nucleation sites for fine recrystallized grains, and the fracture mode was changed due to the formation of a high number of recrystallized grains. The recrystallized grains evolved from the continuous recrystallization process of sub-grain rotation under the influence of thermal-mechanical stress and the discontinuous recrystallization process of deformation storage. |
| format | Article |
| id | doaj-art-986ec0efb9ad48f1856f9e6272a7eda5 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-986ec0efb9ad48f1856f9e6272a7eda52025-01-19T06:25:31ZengElsevierJournal of Materials Research and Technology2238-78542025-01-013411911200Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigueJunjie Zhao0Jun Wu1Jiayu Zhang2Mingqin Liao3Fengjiang Wang4School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212000, ChinaSchool of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212000, ChinaSchool of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212000, ChinaSchool of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212000, ChinaCorresponding author.; School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212000, ChinaThe Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue. During isothermal aging, the size of Sn grain and intermetallic compound (IMC) thickness in solder joints were greatly decreased due to the addition of Bi, especially with 5 wt% addition because the atomic migration to produce IMC layer was hindered by the Bi diffusion layer formed at the IMC interface, which means that Bi can play a role in refining the grains. Meanwhile, the shear strength of Sn-1.0Ag-0.5Cu-xBi solder joints was greatly improved through solid solution strengthening. During thermal cycling, electron backscatter diffraction analysis showed that Bi addition increased the tendency of grains to slip, as indicated by a higher Schmid factor. The thermal fatigue failure modes of micro solder joints with various Bi contents were different. In the absence of Bi addition, the fracture mode of the solder joint was typical transgranular fracture mode. With the addition ofBi element, the solder joints showed an intergranular fracture mode. The addition of Bi provides more heterogeneous nucleation sites for fine recrystallized grains, and the fracture mode was changed due to the formation of a high number of recrystallized grains. The recrystallized grains evolved from the continuous recrystallization process of sub-grain rotation under the influence of thermal-mechanical stress and the discontinuous recrystallization process of deformation storage.http://www.sciencedirect.com/science/article/pii/S2238785424029193Sn-Ag-Cu solderIMC layer evolutionThermal cyclingFatigue crackRecrystallization |
| spellingShingle | Junjie Zhao Jun Wu Jiayu Zhang Mingqin Liao Fengjiang Wang Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue Journal of Materials Research and Technology Sn-Ag-Cu solder IMC layer evolution Thermal cycling Fatigue crack Recrystallization |
| title | Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue |
| title_full | Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue |
| title_fullStr | Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue |
| title_full_unstemmed | Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue |
| title_short | Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue |
| title_sort | intermetallic compound layer and fatigue crack evolution of bi contained sn 1 0ag 0 5cu solder under thermal aging and thermal fatigue |
| topic | Sn-Ag-Cu solder IMC layer evolution Thermal cycling Fatigue crack Recrystallization |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424029193 |
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