APA (7th ed.) Citation

Zhao, J., Wu, J., Zhang, J., Liao, M., & Wang, F. Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue. Elsevier.

Chicago Style (17th ed.) Citation

Zhao, Junjie, Jun Wu, Jiayu Zhang, Mingqin Liao, and Fengjiang Wang. Intermetallic Compound Layer and Fatigue Crack Evolution of Bi-contained Sn-1.0Ag-0.5Cu Solder Under Thermal Aging and Thermal Fatigue. Elsevier.

MLA (9th ed.) Citation

Zhao, Junjie, et al. Intermetallic Compound Layer and Fatigue Crack Evolution of Bi-contained Sn-1.0Ag-0.5Cu Solder Under Thermal Aging and Thermal Fatigue. Elsevier.