Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive
Abstract Integrating surface-mounted devices (SMDs) onto textiles remains a key challenge in wearable electronics due to textile surface irregularities and heat sensitivity. Conventional methods like soldering or anisotropic conductive films (ACFs) often fail in such environments. We introduce a low...
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| Main Authors: | , , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-07-01
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| Series: | npj Flexible Electronics |
| Online Access: | https://doi.org/10.1038/s41528-025-00452-1 |
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