Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive
Abstract Integrating surface-mounted devices (SMDs) onto textiles remains a key challenge in wearable electronics due to textile surface irregularities and heat sensitivity. Conventional methods like soldering or anisotropic conductive films (ACFs) often fail in such environments. We introduce a low...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-07-01
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| Series: | npj Flexible Electronics |
| Online Access: | https://doi.org/10.1038/s41528-025-00452-1 |
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| author | Sang Gil Lee Kyeong-Bin Kim Hyesu Choi Joo Hwan Shin Chanho Jeong Geonoh Choe Gyan Raj Koirala Jae-seung Shim Yujin Mun Young Gil Kim Yei Hwan Jung Eun-Ho Lee Tae-il Kim |
| author_facet | Sang Gil Lee Kyeong-Bin Kim Hyesu Choi Joo Hwan Shin Chanho Jeong Geonoh Choe Gyan Raj Koirala Jae-seung Shim Yujin Mun Young Gil Kim Yei Hwan Jung Eun-Ho Lee Tae-il Kim |
| author_sort | Sang Gil Lee |
| collection | DOAJ |
| description | Abstract Integrating surface-mounted devices (SMDs) onto textiles remains a key challenge in wearable electronics due to textile surface irregularities and heat sensitivity. Conventional methods like soldering or anisotropic conductive films (ACFs) often fail in such environments. We introduce a low-stress anisotropic conductive adhesive (LS-ACA) composed of eutectic gallium–indium (EGaIn) liquid metal particles (LMPs) embedded in a pressure-sensitive SIS matrix. LS-ACA offers excellent electrical conductivity, mechanical flexibility, and durability under bending, stretching, and crumpling. Finite element analysis shows it reduces interfacial stress concentrations compared to soldering, maintaining uniform stress even under 10% strain. It achieves ultra-low contact resistance (1.5 mΩ at >64 wt% LMPs) and enables low-temperature bonding on diverse substrates. Moreover, LS-ACA supports over 10 reuse cycles without surface damage or performance loss. This scalable, reusable material offers a promising path for integrating electronics into fabrics, advancing sustainable and flexible wearable technologies. |
| format | Article |
| id | doaj-art-975bfd30018b45479a2f3ca0653bea5a |
| institution | Kabale University |
| issn | 2397-4621 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | npj Flexible Electronics |
| spelling | doaj-art-975bfd30018b45479a2f3ca0653bea5a2025-08-20T04:02:42ZengNature Portfolionpj Flexible Electronics2397-46212025-07-019111210.1038/s41528-025-00452-1Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesiveSang Gil Lee0Kyeong-Bin Kim1Hyesu Choi2Joo Hwan Shin3Chanho Jeong4Geonoh Choe5Gyan Raj Koirala6Jae-seung Shim7Yujin Mun8Young Gil Kim9Yei Hwan Jung10Eun-Ho Lee11Tae-il Kim12Department of Semiconductor and Display Engineering, Sungkyunkwan University (SKKU)Department of Mechanical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)Department of Electronic Engineering, Hanyang UniversitySchool of Chemical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)Department of Electronic Engineering, Hanyang UniversityDepartment of Mechanical Engineering, Sungkyunkwan University (SKKU)School of Chemical Engineering, Sungkyunkwan University (SKKU)Abstract Integrating surface-mounted devices (SMDs) onto textiles remains a key challenge in wearable electronics due to textile surface irregularities and heat sensitivity. Conventional methods like soldering or anisotropic conductive films (ACFs) often fail in such environments. We introduce a low-stress anisotropic conductive adhesive (LS-ACA) composed of eutectic gallium–indium (EGaIn) liquid metal particles (LMPs) embedded in a pressure-sensitive SIS matrix. LS-ACA offers excellent electrical conductivity, mechanical flexibility, and durability under bending, stretching, and crumpling. Finite element analysis shows it reduces interfacial stress concentrations compared to soldering, maintaining uniform stress even under 10% strain. It achieves ultra-low contact resistance (1.5 mΩ at >64 wt% LMPs) and enables low-temperature bonding on diverse substrates. Moreover, LS-ACA supports over 10 reuse cycles without surface damage or performance loss. This scalable, reusable material offers a promising path for integrating electronics into fabrics, advancing sustainable and flexible wearable technologies.https://doi.org/10.1038/s41528-025-00452-1 |
| spellingShingle | Sang Gil Lee Kyeong-Bin Kim Hyesu Choi Joo Hwan Shin Chanho Jeong Geonoh Choe Gyan Raj Koirala Jae-seung Shim Yujin Mun Young Gil Kim Yei Hwan Jung Eun-Ho Lee Tae-il Kim Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive npj Flexible Electronics |
| title | Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive |
| title_full | Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive |
| title_fullStr | Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive |
| title_full_unstemmed | Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive |
| title_short | Mechanically stable, and reversible integration of microchips on textile: liquid metal-based anisotropic conductive adhesive |
| title_sort | mechanically stable and reversible integration of microchips on textile liquid metal based anisotropic conductive adhesive |
| url | https://doi.org/10.1038/s41528-025-00452-1 |
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