A Novel 3D Mesh-Based NoC Architecture for Performance Improvement

Applying semiconductor technology, network-on-chips (NoCs) are designed on silicon chips to expand on-chip communications. Three-dimensional (3D) mesh-based architecture is also known as a basic NoC architecture characterized by better energy consumption and latency compared with two-dimensional (2D...

Full description

Saved in:
Bibliographic Details
Main Authors: Navid Habibi, MohammadReza Salehnamadi, Ahmad Khademzadeh
Format: Article
Language:English
Published: OICC Press 2022-06-01
Series:Majlesi Journal of Electrical Engineering
Subjects:
Online Access:https://oiccpress.com/mjee/article/view/4953
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1849767231049695232
author Navid Habibi
MohammadReza Salehnamadi
Ahmad Khademzadeh
author_facet Navid Habibi
MohammadReza Salehnamadi
Ahmad Khademzadeh
author_sort Navid Habibi
collection DOAJ
description Applying semiconductor technology, network-on-chips (NoCs) are designed on silicon chips to expand on-chip communications. Three-dimensional (3D) mesh-based architecture is also known as a basic NoC architecture characterized by better energy consumption and latency compared with two-dimensional (2D) ones.  Recently developed architectures are based on regular mesh. However, there are serious drawbacks in NoC architectures including high power consumption, energy consumption, and latency. Therefore, making an improvement in topology diameter would overcome these shortcomings. Accordingly, a new 3D mesh-based NoC architecture is proposed in the present study utilizing the star node, consisting of a new 3D topology with small diameter and new deadlock-free routing. The diameter of this architecture is then compared with its counterparts. Afterwards, the scalable universal matrix multiplication algorithm (SUMMA) is implemented in the proposed architecture. The results indicate a smaller network diameter, lower energy consumption (32%), less network latency (8.6%), as well as enhancement in throughput average (13.6%). The proposed matrix multiplication algorithm also implies improvement in the cost of the proposed architecture in comparison with its counterparts.
format Article
id doaj-art-962cd5656eaf404bbb4d9e71d9d5cb6d
institution DOAJ
issn 2345-377X
2345-3796
language English
publishDate 2022-06-01
publisher OICC Press
record_format Article
series Majlesi Journal of Electrical Engineering
spelling doaj-art-962cd5656eaf404bbb4d9e71d9d5cb6d2025-08-20T03:04:17ZengOICC PressMajlesi Journal of Electrical Engineering2345-377X2345-37962022-06-0116210.30486/mjee.2022.696497A Novel 3D Mesh-Based NoC Architecture for Performance ImprovementNavid Habibi0MohammadReza Salehnamadi1Ahmad Khademzadeh2Department of Computer Engineering, South Tehran Branch, Islamic Azad University, Tehran, Iran) Department of Computer Engineering, South Tehran Branch, Islamic Azad University, Tehran, IranTelecommunication Research Center, Tehran, IranApplying semiconductor technology, network-on-chips (NoCs) are designed on silicon chips to expand on-chip communications. Three-dimensional (3D) mesh-based architecture is also known as a basic NoC architecture characterized by better energy consumption and latency compared with two-dimensional (2D) ones.  Recently developed architectures are based on regular mesh. However, there are serious drawbacks in NoC architectures including high power consumption, energy consumption, and latency. Therefore, making an improvement in topology diameter would overcome these shortcomings. Accordingly, a new 3D mesh-based NoC architecture is proposed in the present study utilizing the star node, consisting of a new 3D topology with small diameter and new deadlock-free routing. The diameter of this architecture is then compared with its counterparts. Afterwards, the scalable universal matrix multiplication algorithm (SUMMA) is implemented in the proposed architecture. The results indicate a smaller network diameter, lower energy consumption (32%), less network latency (8.6%), as well as enhancement in throughput average (13.6%). The proposed matrix multiplication algorithm also implies improvement in the cost of the proposed architecture in comparison with its counterparts.https://oiccpress.com/mjee/article/view/4953CommunicationNetwork-on-Chipnetworks ArchitecturePerformance EvaluationSystem-on-chip. Routing ProtocolsTopology
spellingShingle Navid Habibi
MohammadReza Salehnamadi
Ahmad Khademzadeh
A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
Majlesi Journal of Electrical Engineering
Communication
Network-on-Chip
networks Architecture
Performance Evaluation
System-on-chip. Routing Protocols
Topology
title A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
title_full A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
title_fullStr A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
title_full_unstemmed A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
title_short A Novel 3D Mesh-Based NoC Architecture for Performance Improvement
title_sort novel 3d mesh based noc architecture for performance improvement
topic Communication
Network-on-Chip
networks Architecture
Performance Evaluation
System-on-chip. Routing Protocols
Topology
url https://oiccpress.com/mjee/article/view/4953
work_keys_str_mv AT navidhabibi anovel3dmeshbasednocarchitectureforperformanceimprovement
AT mohammadrezasalehnamadi anovel3dmeshbasednocarchitectureforperformanceimprovement
AT ahmadkhademzadeh anovel3dmeshbasednocarchitectureforperformanceimprovement
AT navidhabibi novel3dmeshbasednocarchitectureforperformanceimprovement
AT mohammadrezasalehnamadi novel3dmeshbasednocarchitectureforperformanceimprovement
AT ahmadkhademzadeh novel3dmeshbasednocarchitectureforperformanceimprovement