Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages
The electrodeposition of copper (Cu), silver (Ag), and their alloys has been a subject of interest since the 19th century. Primarily due to their exceptional features such as good mechanical hardness and electrical conductivity, high resistance to corrosion, and electromigration, Cu–Ag electrodeposi...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-07-01
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| Series: | Compounds |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-6918/4/3/28 |
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