Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages
The electrodeposition of copper (Cu), silver (Ag), and their alloys has been a subject of interest since the 19th century. Primarily due to their exceptional features such as good mechanical hardness and electrical conductivity, high resistance to corrosion, and electromigration, Cu–Ag electrodeposi...
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MDPI AG
2024-07-01
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| author | Sofya Efimova Florica Simescu Lazar Jean-Paul Chopart François Debray Anne-Lise Daltin |
| author_facet | Sofya Efimova Florica Simescu Lazar Jean-Paul Chopart François Debray Anne-Lise Daltin |
| author_sort | Sofya Efimova |
| collection | DOAJ |
| description | The electrodeposition of copper (Cu), silver (Ag), and their alloys has been a subject of interest since the 19th century. Primarily due to their exceptional features such as good mechanical hardness and electrical conductivity, high resistance to corrosion, and electromigration, Cu–Ag electrodeposits continue to be investigated and developed to improve their properties for different applications. This paper reviews the state of the art in the field of electroplated Cu–Ag alloys in an aqueous solution, with particular emphasis on the observed properties and variety of electrochemical processes used to produce high-quality materials. Moreover, this review paper focuses on the experimental conditions employed for Cu–Ag electrodeposition, intending to understand the basis and manipulate the processes to obtain coatings with superior characteristics and for attractive usage. Finally, the most trending applications of these coatings are discussed depending on different parameters of electrodeposition to provide prospects for potential research. |
| format | Article |
| id | doaj-art-95a4db58c8a94dc79db100e519f38016 |
| institution | OA Journals |
| issn | 2673-6918 |
| language | English |
| publishDate | 2024-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Compounds |
| spelling | doaj-art-95a4db58c8a94dc79db100e519f380162025-08-20T01:55:22ZengMDPI AGCompounds2673-69182024-07-014345347810.3390/compounds4030028Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous UsagesSofya Efimova0Florica Simescu Lazar1Jean-Paul Chopart2François Debray3Anne-Lise Daltin4Matériaux et Ingénierie Mécanique (MATIM), Université de Reims Champagne-Ardenne, 51100 Reims, FranceMatériaux et Ingénierie Mécanique (MATIM), Université de Reims Champagne-Ardenne, 51100 Reims, FranceMatériaux et Ingénierie Mécanique (MATIM), Université de Reims Champagne-Ardenne, 51100 Reims, FranceLaboratoire National des Champs Magnétiques Intenses, CNRS-INSA-UGA-UPS-EMFL, 38042 Grenoble, Cedex 9, FranceMatériaux et Ingénierie Mécanique (MATIM), Université de Reims Champagne-Ardenne, 51100 Reims, FranceThe electrodeposition of copper (Cu), silver (Ag), and their alloys has been a subject of interest since the 19th century. Primarily due to their exceptional features such as good mechanical hardness and electrical conductivity, high resistance to corrosion, and electromigration, Cu–Ag electrodeposits continue to be investigated and developed to improve their properties for different applications. This paper reviews the state of the art in the field of electroplated Cu–Ag alloys in an aqueous solution, with particular emphasis on the observed properties and variety of electrochemical processes used to produce high-quality materials. Moreover, this review paper focuses on the experimental conditions employed for Cu–Ag electrodeposition, intending to understand the basis and manipulate the processes to obtain coatings with superior characteristics and for attractive usage. Finally, the most trending applications of these coatings are discussed depending on different parameters of electrodeposition to provide prospects for potential research.https://www.mdpi.com/2673-6918/4/3/28Cu–Ag alloyelectrodepositioncoatingelectrocatalystmetal interconnection |
| spellingShingle | Sofya Efimova Florica Simescu Lazar Jean-Paul Chopart François Debray Anne-Lise Daltin Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages Compounds Cu–Ag alloy electrodeposition coating electrocatalyst metal interconnection |
| title | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages |
| title_full | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages |
| title_fullStr | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages |
| title_full_unstemmed | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages |
| title_short | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages |
| title_sort | electrodeposition of copper silver alloys from aqueous solutions a prospective process for miscellaneous usages |
| topic | Cu–Ag alloy electrodeposition coating electrocatalyst metal interconnection |
| url | https://www.mdpi.com/2673-6918/4/3/28 |
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