Interfacial reactions between solid Ni and liquid Sn-Zn alloys
The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450°C were studied. Three intermetallic compounds Ni3Sn4, T1,...
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| Format: | Article |
| Language: | English |
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University of Belgrade, Technical Faculty, Bor
2015-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
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| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2015/1450-53391500021G.pdf |
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| _version_ | 1832570575796568064 |
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| author | Gandova V. |
| author_facet | Gandova V. |
| author_sort | Gandova V. |
| collection | DOAJ |
| description | The limitation of the harmful lead-containing solders used in the electronics
and other industry applications change lead with another metals. Interfacial
reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and
450°C were studied. Three intermetallic compounds Ni3Sn4, T1, γ-Ni5Zn21 and
liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron
microscope was used for the investigation of the microstructure. The
microhardness measurement of the intermetallic layers was also performed. |
| format | Article |
| id | doaj-art-93532443a3d14a998a94ac8395add29d |
| institution | Kabale University |
| issn | 1450-5339 2217-7175 |
| language | English |
| publishDate | 2015-01-01 |
| publisher | University of Belgrade, Technical Faculty, Bor |
| record_format | Article |
| series | Journal of Mining and Metallurgy. Section B: Metallurgy |
| spelling | doaj-art-93532443a3d14a998a94ac8395add29d2025-02-02T15:15:30ZengUniversity of Belgrade, Technical Faculty, BorJournal of Mining and Metallurgy. Section B: Metallurgy1450-53392217-71752015-01-0151217918410.2298/JMMB141101021G1450-53391500021GInterfacial reactions between solid Ni and liquid Sn-Zn alloysGandova V.0University of Food Technologies, Inorganic and Physical Chemistry Department, Plovdiv, BulgariaThe limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450°C were studied. Three intermetallic compounds Ni3Sn4, T1, γ-Ni5Zn21 and liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron microscope was used for the investigation of the microstructure. The microhardness measurement of the intermetallic layers was also performed.http://www.doiserbia.nb.rs/img/doi/1450-5339/2015/1450-53391500021G.pdfsoldersternary systemsdiffusion couplesphase diagrams |
| spellingShingle | Gandova V. Interfacial reactions between solid Ni and liquid Sn-Zn alloys Journal of Mining and Metallurgy. Section B: Metallurgy solders ternary systems diffusion couples phase diagrams |
| title | Interfacial reactions between solid Ni and liquid Sn-Zn alloys |
| title_full | Interfacial reactions between solid Ni and liquid Sn-Zn alloys |
| title_fullStr | Interfacial reactions between solid Ni and liquid Sn-Zn alloys |
| title_full_unstemmed | Interfacial reactions between solid Ni and liquid Sn-Zn alloys |
| title_short | Interfacial reactions between solid Ni and liquid Sn-Zn alloys |
| title_sort | interfacial reactions between solid ni and liquid sn zn alloys |
| topic | solders ternary systems diffusion couples phase diagrams |
| url | http://www.doiserbia.nb.rs/img/doi/1450-5339/2015/1450-53391500021G.pdf |
| work_keys_str_mv | AT gandovav interfacialreactionsbetweensolidniandliquidsnznalloys |