Interfacial reactions between solid Ni and liquid Sn-Zn alloys
The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450°C were studied. Three intermetallic compounds Ni3Sn4, T1,...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
University of Belgrade, Technical Faculty, Bor
2015-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2015/1450-53391500021G.pdf |
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| Summary: | The limitation of the harmful lead-containing solders used in the electronics
and other industry applications change lead with another metals. Interfacial
reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and
450°C were studied. Three intermetallic compounds Ni3Sn4, T1, γ-Ni5Zn21 and
liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron
microscope was used for the investigation of the microstructure. The
microhardness measurement of the intermetallic layers was also performed. |
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| ISSN: | 1450-5339 2217-7175 |