On-chip integration of achromatic metalens arrays

Abstract Broadband achromatic metalenses and metalens arrays hold promise for enabling high-performance optical imaging in a compact form factor. Conventional visible-light achromatic metalenses are composed of transparent and high-refractive-index TiO2 or GaN nanopillars, but are strongly limited i...

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Main Authors: Yao Zhang, Xiong Jiang, Geyang Qu, Jing Han, Chen Li, Baichuan Bo, Qifeng Ruan, Zhengtong Liu, Qinghai Song, Shumin Xiao
Format: Article
Language:English
Published: Nature Portfolio 2025-08-01
Series:Nature Communications
Online Access:https://doi.org/10.1038/s41467-025-62539-7
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author Yao Zhang
Xiong Jiang
Geyang Qu
Jing Han
Chen Li
Baichuan Bo
Qifeng Ruan
Zhengtong Liu
Qinghai Song
Shumin Xiao
author_facet Yao Zhang
Xiong Jiang
Geyang Qu
Jing Han
Chen Li
Baichuan Bo
Qifeng Ruan
Zhengtong Liu
Qinghai Song
Shumin Xiao
author_sort Yao Zhang
collection DOAJ
description Abstract Broadband achromatic metalenses and metalens arrays hold promise for enabling high-performance optical imaging in a compact form factor. Conventional visible-light achromatic metalenses are composed of transparent and high-refractive-index TiO2 or GaN nanopillars, but are strongly limited in mainstream silicon-based complementary metal-oxide-semiconductor (CMOS) processes. Herein, we report the realization of high-efficiency Si3N4 achromatic metalenses in the visible range and demonstrate their integration onto a commercial imaging chip. By improving nanofabrication techniques, we have dramatically increased the aspect ratio of Si3N4 nanostructures from ~17 to a high value of 43.33. Consequently, the group delay of the Si3N4 nanostructures is significantly increased and the averaged focusing efficiency of a Si3N4 metalens with a numerical aperture of 0.155 reaches 80.39%. Owing to the CMOS-compatibility of Si3N4, such high-quality metalenses have been integrated with commercial imaging sensors and demonstrated the capability of full-color optical imaging. This research paves a critical step towards chip-integrated meta-devices.
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publishDate 2025-08-01
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spelling doaj-art-9345bddf9cff4b39b81f7530b0f3d8902025-08-20T03:05:10ZengNature PortfolioNature Communications2041-17232025-08-011611810.1038/s41467-025-62539-7On-chip integration of achromatic metalens arraysYao Zhang0Xiong Jiang1Geyang Qu2Jing Han3Chen Li4Baichuan Bo5Qifeng Ruan6Zhengtong Liu7Qinghai Song8Shumin Xiao9Ministry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenPengcheng Laboratory, ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenMinistry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology ShenzhenAbstract Broadband achromatic metalenses and metalens arrays hold promise for enabling high-performance optical imaging in a compact form factor. Conventional visible-light achromatic metalenses are composed of transparent and high-refractive-index TiO2 or GaN nanopillars, but are strongly limited in mainstream silicon-based complementary metal-oxide-semiconductor (CMOS) processes. Herein, we report the realization of high-efficiency Si3N4 achromatic metalenses in the visible range and demonstrate their integration onto a commercial imaging chip. By improving nanofabrication techniques, we have dramatically increased the aspect ratio of Si3N4 nanostructures from ~17 to a high value of 43.33. Consequently, the group delay of the Si3N4 nanostructures is significantly increased and the averaged focusing efficiency of a Si3N4 metalens with a numerical aperture of 0.155 reaches 80.39%. Owing to the CMOS-compatibility of Si3N4, such high-quality metalenses have been integrated with commercial imaging sensors and demonstrated the capability of full-color optical imaging. This research paves a critical step towards chip-integrated meta-devices.https://doi.org/10.1038/s41467-025-62539-7
spellingShingle Yao Zhang
Xiong Jiang
Geyang Qu
Jing Han
Chen Li
Baichuan Bo
Qifeng Ruan
Zhengtong Liu
Qinghai Song
Shumin Xiao
On-chip integration of achromatic metalens arrays
Nature Communications
title On-chip integration of achromatic metalens arrays
title_full On-chip integration of achromatic metalens arrays
title_fullStr On-chip integration of achromatic metalens arrays
title_full_unstemmed On-chip integration of achromatic metalens arrays
title_short On-chip integration of achromatic metalens arrays
title_sort on chip integration of achromatic metalens arrays
url https://doi.org/10.1038/s41467-025-62539-7
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