Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste
Abstract Wide bandgap (WBG) power semiconductors have attracted significant attention from both academia and industry because they are superior to conventional silicon-based devices. In WBG power semiconductor packages, die attach materials play a crucial role in maximizing device performance and re...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2025-07-01
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| Series: | Nano Convergence |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s40580-025-00503-3 |
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