Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste
Abstract Wide bandgap (WBG) power semiconductors have attracted significant attention from both academia and industry because they are superior to conventional silicon-based devices. In WBG power semiconductor packages, die attach materials play a crucial role in maximizing device performance and re...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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SpringerOpen
2025-07-01
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| Series: | Nano Convergence |
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| Online Access: | https://doi.org/10.1186/s40580-025-00503-3 |
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| _version_ | 1849343608978669568 |
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| author | Young-Min Ju Tae-Wan Kim Seung-Hyun Lee Ho-Jin Lee Jinho Ahn Hak-Sung Kim |
| author_facet | Young-Min Ju Tae-Wan Kim Seung-Hyun Lee Ho-Jin Lee Jinho Ahn Hak-Sung Kim |
| author_sort | Young-Min Ju |
| collection | DOAJ |
| description | Abstract Wide bandgap (WBG) power semiconductors have attracted significant attention from both academia and industry because they are superior to conventional silicon-based devices. In WBG power semiconductor packages, die attach materials play a crucial role in maximizing device performance and reliability. The die attach interfaces in WBG packages must withstand high operating temperatures (200–300 °C), fast switching frequencies, and great power densities while maintaining excellent thermomechanical reliability. Traditional die attach materials have significant limitations when applied to WBG devices, which has led to intensive research into nanomaterial-based alternatives during the past decade. This review summarizes current state-of-the-art nano-enabled die attach technologies: nanocomposite solders, nano-sintering approaches, and novel nanomaterial formulations specifically engineered for WBG power semiconductor packages. We examine the fundamental mechanisms behind the performance of nanomaterial die attach solutions and their ability to address the thermal management challenges of WBG devices. Furthermore, we examine the reliability of these materials in extreme operating conditions by evaluating their thermal cycling performance, shear strength stability, and microstructural evolution. Graphical abstract |
| format | Article |
| id | doaj-art-92e6855b617945fbbac5dcd62a243d06 |
| institution | Kabale University |
| issn | 2196-5404 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Nano Convergence |
| spelling | doaj-art-92e6855b617945fbbac5dcd62a243d062025-08-20T03:42:56ZengSpringerOpenNano Convergence2196-54042025-07-0112115310.1186/s40580-025-00503-3Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach pasteYoung-Min Ju0Tae-Wan Kim1Seung-Hyun Lee2Ho-Jin Lee3Jinho Ahn4Hak-Sung Kim5Department of Mechanical Engineering, Hanyang UniversityDepartment of Mechanical Engineering, Hanyang UniversityDepartment of Mechanical Engineering, Hanyang UniversityDepartment of Mechanical Engineering, Hanyang UniversityDivision of Materials Science and Engineering, Hanyang UniversityDepartment of Mechanical Engineering, Hanyang UniversityAbstract Wide bandgap (WBG) power semiconductors have attracted significant attention from both academia and industry because they are superior to conventional silicon-based devices. In WBG power semiconductor packages, die attach materials play a crucial role in maximizing device performance and reliability. The die attach interfaces in WBG packages must withstand high operating temperatures (200–300 °C), fast switching frequencies, and great power densities while maintaining excellent thermomechanical reliability. Traditional die attach materials have significant limitations when applied to WBG devices, which has led to intensive research into nanomaterial-based alternatives during the past decade. This review summarizes current state-of-the-art nano-enabled die attach technologies: nanocomposite solders, nano-sintering approaches, and novel nanomaterial formulations specifically engineered for WBG power semiconductor packages. We examine the fundamental mechanisms behind the performance of nanomaterial die attach solutions and their ability to address the thermal management challenges of WBG devices. Furthermore, we examine the reliability of these materials in extreme operating conditions by evaluating their thermal cycling performance, shear strength stability, and microstructural evolution. Graphical abstracthttps://doi.org/10.1186/s40580-025-00503-3Wideband gap semiconductor packageReliabilityNanomaterialDie attach technology |
| spellingShingle | Young-Min Ju Tae-Wan Kim Seung-Hyun Lee Ho-Jin Lee Jinho Ahn Hak-Sung Kim Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste Nano Convergence Wideband gap semiconductor package Reliability Nanomaterial Die attach technology |
| title | Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste |
| title_full | Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste |
| title_fullStr | Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste |
| title_full_unstemmed | Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste |
| title_short | Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste |
| title_sort | advanced wbg power semiconductor packaging nanomaterials and nanotechnologies for high performance die attach paste |
| topic | Wideband gap semiconductor package Reliability Nanomaterial Die attach technology |
| url | https://doi.org/10.1186/s40580-025-00503-3 |
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