Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials
Thermal fatigue tests of semiconductor packages were conducted varying solder materials such as SAC305 and SAC302 with Bi, Ni, and Pd (named hybrid solder ball, HSB) and number of chips inside the package at temperatures ranging from 0 °C to 120°. The fatigue life and fatigue crack types of the sold...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525004794 |
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